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  • BS EN 123000:1992

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Harmonized system of quality assessment for electronic components. Generic specification: printed boards

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  22-10-2021

    Language(s):  English

    Published date:  29-09-1989

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1. General
    1.1 Scope
    1.2 Object
    1.3 Related documents
    1.4 General consideration
    1.5 Specification structure
    2. Particular stipulations
    2.1 Primary stage of manufacture
    2.2 Structurally similar printed boards
    2.3 Certified test records
    2.4 Delayed delivery
    2.5 Release for delivery before the completion of
          Group B tests
    2.6 Resubmission of rejected lots
    2.7 Marking of printed board and package
    2.8 Ordering information
    3. Capability approval and maintenance of capability
          approval
    3.1 General
    3.2 Capability approval requirements
    3.3 Description of capability
    3.4 QPL-information
    3.5 Demonstration of capability
    3.6 Capability approval test report
    3.7 Range of capability approval
    3.8 Maintenance of capability approval
    3.9 Suspension and withdrawal of capability approval
    3.10 Capability approval testing, sample size and
          number of failures
    3.11 Inspection information in the Cap DS
    4. Quality conformance inspection
    4.1 Inspection lot
    4.2 Small lots and/or expensive printed boards
    4.3 Grouping of tests
    4.4 Inspection information in the CDS
    4.5 In-process testing
    4.6 Indirect measuring methods
    5. Rules for the preparation of Detail Specifications
    5.1 Capability Detail Specification (Cap DS)
    5.2 Customer Detail Specification (CDS)
    Appendix A - Example of a CDS
    Appendix B - Specification structure
    Appendix C - Example of QPL entries
    Appendix D - Survey of abbreviations
    Appendix E - Guide to the preparation of a Capability Manual for
                 printed boards

    Abstract - (Show below) - (Hide below)

    Defines system and procedure for approval of manufacturers and products and provides rules for the preparation of specifications.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Renumbers and supersedes BS CECC23000(1989). 1992 Version incorporates amendment 7145 to BS CECC23000(1989). Supersedes 86/31647 DC, 94/216046 DC and 94/206559 DC. (09/2005)
    Document Type Standard
    Publisher British Standards Institution
    Status Withdrawn
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS 123100-003:2001 System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
    BS 123800:2001 System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
    BS 123100:2001 System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes
    BS CECC 23100-003:1996 Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes
    BS EN 123800:1997 Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections
    BS CECC 23200-003:1996 Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes
    BS 9450:1998 Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures). Generic data and methods of test
    BS CECC 23300-003:1996 Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
    BS CECC 123400-003:1994 Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
    BS CECC 23600-801:1998 Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
    BS 123400:2001 System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards without through-connections
    BS 123000:2001 System of quality assessment. Generic specification. Printed boards
    BS 123400-003:2001 System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
    BS 123700-003:2001 System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
    BS 123600:2001 System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
    BS 123500:2001 System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
    BS 123700:2001 System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections
    BS 123200:2001 System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
    BS 123500-003:2001 System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
    BS 123800-003:2001 System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
    BS EN 123600:1997 Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections
    BS 123600-003:2001 System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
    BS CECC 123500-003:1994 Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
    BS 123300:2001 System of quality assessment. Sectional specification. Rigid multilayer printed boards
    BS 6312-2.2:1997 Connectors for analogue telecommunication interfaces Sockets for use with plugs specified in BS 6312-1 - Particular requirements for fixed socket-outlets used in permanent wiring installations
    BS EN 123700:1997 Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid double sided printed boards with through connections

    Standards Referencing This Book - (Show below) - (Hide below)

    BS 9000-2(1996) : 1996 GENERAL REQUIREMENTS FOR A SYSTEM FOR ELECTRONIC COMPONENTS OF ASSESSED QUALITY - SPECIFICATION FOR THE NATIONAL IMPLEMENTATION OF THE CECC SYSTEM
    BS 6001-1(1999) : 1999 SAMPLING PROCEDURES FOR INSPECTION BY ATTRIBUTES - PART 1: SAMPLING SCHEMES INDEXED BY ACCEPTANCE QUALITY LIMIT (AQL) FOR LOT-BY-LOT INSPECTION
    CECC 00010 : 1980 AMD 1 BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS
    BS 6221-2:1991 Printed wiring boards Methods of test
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    CECC 00200 : 2002 REGISTER OF FIRMS, PRODUCTS AND SERVICES APPROVED UNDER CECC CERTIFICATION SYSTEM FOR ELECTRONIC COMPONENTS
    BS 4584:1970 Specification for metal clad base materials for printed circuits. Methods of test
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