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  • BS EN 62258-1:2010

    Current The latest, up-to-date edition.

    Semiconductor die products Procurement and use

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  30-11-2010

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General requirements
    5 Data exchange
    6 Requirements for all devices
    7 Requirements for bare die and wafers with or without
       connection structures
    8 Minimally-packaged devices
    9 Quality, test and reliability
    10 Handling and packing
    11 Storage
    12 Assembly
    Annex A (informative) - Terminology
    Annex B (informative) - Acronyms
    Annex ZA (normative) - Normative references to international
             publications with their corresponding European
             publications
    Bibliography

    Abstract - (Show below) - (Hide below)

    Describes the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products.

    Scope - (Show below) - (Hide below)

    IEC 62258-1:2009 has been developed to facilitate the production, supply and use of semiconductor die products, including:
    - wafers,
    - singulated bare die,
    - die and wafers with attached connection structures,
    - minimally or partially encapsulated die and wafers.
    This standard defines the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products. It covers the requirements for data, including:
    - product identity,
    - product data,
    - die mechanical information,
    - test, quality, assembly and reliability information,
    - handling, shipping and storage information.
    The main changes that have been introduced in this edition have been to ensure consistency across all parts of the standard. The ordering of the subclauses, particularly in Clause 6, has been changed to be more logical and the text of some of the requirements has been amended to add requirements on further information as covered by IEC/TR 62258-4, IEC/TR 62258-7 and IEC/TR 62258-8. New requirements include information on permutability of terminals and functional elements (6.6.4) and moisture sensitivity for partially encapsulated devices (8.8).

    General Product Information - (Show below) - (Hide below)

    Committee EPL/47
    Development Note Supersedes BS PD ES 59008-1, BS PD ES 59008-2 and BS PD ES 59008-3. Supersedes 01/206130 DC. (03/2006)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    IPC J STD 026 : 0 SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS
    ISO/IEC 11179-3:2013 Information technology — Metadata registries (MDR) — Part 3: Registry metamodel and basic attributes
    EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
    IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
    MIL-PRF-19500 Revision P:2010 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
    EIA 554 : 1996 METHOD SELECTION FOR ASSESSMENT OF NONCONFORMING LEVELS IN PARTS PER MILLION (PPM)
    MIL-PRF-38534 Revision J:2015 HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR
    IEC TR 61340-5-2:2007 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
    IEC 60749-27:2006+AMD1:2012 CSV Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
    IEC 62258-5:2006 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
    FED-STD-209 Revision E:1992 AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES
    IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    IPC J STD 012 : 0 IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY
    IEC TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
    IEC 61360-1:2017 Standard data element types with associated classification scheme - Part 1: Definitions - Principles and methods
    CLC/TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
    CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
    IEEE 1076-2008 REDLINE IEEE Standard VHDL Language Reference Manual
    EN 62258-6 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
    IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    EN 62258-5 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
    IEC TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange
    ISO 8879:1986 Information processing Text and office systems Standard Generalized Markup Language (SGML)
    IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
    IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
    ISO 14644-1:2015 Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration
    IEC 62258-6:2006 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
    ISO 9000:2015 Quality management systems — Fundamentals and vocabulary
    IPC J STD 028 : 0 PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS
    IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
    CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
    IEC TR 62258-4:2012 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
    EIA 557 : 2006 STATISTICAL PROCESS CONTROL SYSTEMS
    EN ISO 14644-1:2015 Cleanrooms and associated controlled environments - Part 1: Classification of air cleanliness by particle concentration (ISO 14644-1:2015)
    CLC/TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange
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