Skip to content
Please enter a keyword to search

  • BS EN 62572-3:2016

    Current The latest, up-to-date edition.

    Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  30-06-2016

    Publisher:  British Standards Institution

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms, definitions, symbols
      and abbreviations
    4 Laser reliability and quality assurance
      procedure
    5 Tests
    6 Activities
    Annex A (informative) - Guidance on testing
            in Table 1 and Table 2
    Bibliography
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Specifies reliability assessment of laser modules used for telecommunication.

    Scope - (Show below) - (Hide below)

    This part of IEC 62572 deals with reliability assessment of laser modules used for telecommunication.

    The aim of this standard is

    • to establish a standard method of assessing the reliability of laser modules in order to minimize risks and to promote product development and reliability;

    • to establish means by which the distribution of failures with time can be determined. This should enable the determination of equipment failure rates for specified end of life criteria.

    In addition, guidance is given in IEC TR 62572-2.

    General Product Information - (Show below) - (Hide below)

    Committee GEL/86/3
    Development Note Supersedes 09/30183239 DC. (03/2012) Supersedes 13/30277892 DC. (08/2014) Supersedes 15/30323391 DC. (06/2016)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
    EN 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
    EN 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
    IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    EN 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
    IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
    EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
    IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
    EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
    EN 60749-26:2014 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
    IEC TR 62572-2:2008 Fibre optic active components and devices - Reliability standards - Part 2: Laser module degradation
    EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    IEC 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
    EN 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective