• BS IEC 60300-3.7 : 1999

    Current The latest, up-to-date edition.

    DEPENDABILITY MANAGEMENT - APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-1999

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Definitions
    4 Acronyms
    5 General considerations for a reliability stress
        screening programme
    6 General information about the reliability stress
        screening process
    7 Analysis of the benefits of the reliability stress
        screening process
    8 Characteristics of a successful reliability stress
        screening programme
    9 Screening types
    10 Screening levels
    11 Screening strength
    12 Selection of screens
    13 Flaws detected by a reliability stress screening
        process
    14 Pre-production screening process
    15 Planning, performing and eliminating a reliability
        stress screening process
        15.1 General
        15.2 Step 1 - Identification of objectives and goals
        15.3 Step 2 - Screening process design and application
        15.4 Step 3 - Cost-benefit analysis
        15.5 Step 4 - Preparation of a screening plan
        15.6 Step 5 - Screening process data collection,
               analysis and corrective actions
    Figures
    1 Levels where reliability stress screening can be
        performed
    2 Reliability stress screening of repairable items
    3 Flow chart for control of a reliability stress
        screening process
    A.1 Level chosen for the RSS process
    Table
    A.1 Relation between the sensitivity of flaws and stresses
    Annex A (informative) RSS of repairable items produced
    in lots
    Annex B (informative) RSS of electronic components

    Abstract - (Show below) - (Hide below)

    Acts as an application guide to a reliability stress screening process for electronic hardware. Explains the concept, purpose and justification of the screening process, and states the main elements of a screening programme, as well as the general planning method.

    General Product Information - (Show below) - (Hide below)

    Committee DS/1/1
    Development Note Supersedes 96/402942 DC. (06/2005)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    03/101534 DC : DRAFT JAN 2003 BS 5760-4 - RELIABILITY OF SYSTEMS, EQUIPMENT AND COMPONENTS - PART 4: GUIDE TO THE SPECIFICATION OF DEPENDABILITY REQUIREMENTS
    BS 5760-4:2003 Reliability of systems, equipment and components Guide to the specification of dependability requirements

    Standards Referencing This Book - (Show below) - (Hide below)

    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    MIL-STD-750 Revision F:2011 TEST METHODS FOR SEMICONDUCTOR DEVICES
    IEC 61163-1:2006 Reliability stress screening - Part 1: Repairable assemblies manufactured in lots
    IEC 61163-2:1998 Reliability stress screening - Part 2: Electronic components
    IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
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