• CEI 56-36 : 2000

    Current The latest, up-to-date edition.

    RELIABILITY STRESS SCREENING - PART 2: ELECTRONIC COMPONENTS

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2000

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Introduction
    1 Scope
    2 Normative references
    3 Definitions
    4 Procedure
    Annex A (informative) - Examples of tools for
             identifying failure mechanisms in
             electronic components
    Annex B (informative) - Data analysis
    Annex C (informative) - Examples of applications
            of reliability stress screening processes

    Abstract - (Show below) - (Hide below)

    Gives a guide on reliability stress screening techniques and procedures for electronic components. This standard is meant for the use of component manufacturers as a guideline, and component users as a guideline for negotiating with component manufacturers on stress screening requirements also subcontractors who give stress screening as a service.

    General Product Information - (Show below) - (Hide below)

    Committee CT 56
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Current
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61163-1:2006 Reliability stress screening - Part 1: Repairable assemblies manufactured in lots
    IEC 60300-1:2014 Dependability management - Part 1: Guidance for management and application
    IEC 60300-3-7:1999 Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware
    IEC 61709 : 3.0 ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
    IEC 60300-2:2004 Dependability management - Part 2: Guidelines for dependability management
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