1 SCOPE
1.1 Scope
2 REFERENCED DOCUMENTS
2.1 Government documents
2.2 Other publications
2.3 Order of precedence
3 DEFINITIONS
3.1 Terms and definitions
4 GENERAL REQUIREMENTS
4.1 Conflict
4.2 Materials
4.3 Work areas, tools and equipment
4.4 Solderability
4.5 Electrostatic discharge protection
4.6 Preparation for soldering
4.7 Attachment of wires and leads
4.8 Cooling
4.9 Rework
4.10 Surface mounted devices
5 DETAIL REQUIREMENTS
5.1 Post soldering cleaning
5.2 Manual soldering
5.3 Wave soldering for printed wiring assemblies
5.4 Reflow soldering
5.5 Additional soldering procedures
5.6 Workmanship
5.7 Characteristics of acceptable solder connections
6 NOTES
6.1 Supersession note
6.2 Changes from previous issue
6.3 Subject term (key word) listing
6.4 Use of metric units
INDEX
INDEX OF REFERENCED DOCUMENTS