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    I.S. EN 60747-15:2012

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV))

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2012

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Letter symbols
    5 Essential ratings (limiting values) and
      characteristics
    6 Measurement methods
    7 Acceptance and reliability
    Annex A (informative) - Test method of peak case
            non-rupture current
    Annex B (informative) - Measuring method of the
            thickness of thermal compound paste
    Bibliography
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Provides the requirements for isolated power semiconductor devices excluding devices with incorporated control circuits.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60112:2003+AMD1:2009 CSV Method for the determination of the proof and the comparative tracking indices of solid insulating materials
    IEC 60270:2000+AMD1:2015 CSV High-voltage test techniques - Partial discharge measurements
    IEC 60747-7:2010 Semiconductor devices - Discrete devices - Part 7: Bipolar transistors
    IEC 61287-1:2014 Railway applications - Power converters installed on board rolling stock - Part 1: Characteristics and test methods
    EN 60749-15:2010/AC:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
    IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
    IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
    IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
    EN 60749-34:2010 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
    EN 60270:2001/A1:2016 HIGH-VOLTAGE TEST TECHNIQUES - PARTIAL DISCHARGE MEASUREMENTS (IEC 60270:2000/A1:2015)
    EN 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
    IEC 60747-9:2007 Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs)
    EN 60749-21:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
    IEC 60747-8:2010 Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
    IEC 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
    EN 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
    EN 60664-1:2007 Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests
    IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
    IEC 60749-34:2010 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
    IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
    IEC 60721-3-3:1994+AMD1:1995+AMD2:1996 CSV Classification of environmental conditions - Part 3-3: Classification of groups of environmental parameters and their severities - Stationary use at weatherprotected locations
    EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
    IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
    IEC 60747-6:2016 Semiconductor devices - Part 6: Discrete devices - Thyristors
    EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
    IEC 60664-1:2007 Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests
    IEC 60747-2:2016 Semiconductor devices - Part 2: Discrete devices - Rectifier diodes
    IEC 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
    EN 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
    EN 60721-3-3 : 95 AMD 2 97 CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - CLASSIFICATION OF GROUPS OF ENVIRONMENTAL PARAMETERS AND THEIR SEVERITIES - STATIONARY USE AT WEATHER-PROTECTED LOCATIONS
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