MIL-STD-883 Revision K:2016
|
TEST METHOD STANDARD - MICROCIRCUITS |
IPC J STD 026 : 0
|
SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS |
ISO/IEC 11179-3:2013
|
Information technology — Metadata registries (MDR) — Part 3: Registry metamodel and basic attributes |
EN 62258-2:2011
|
SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
IEC 61340-5-1:2016
|
Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
MIL-PRF-19500 Revision P:2010
|
SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
EIA 554 : 1996
|
METHOD SELECTION FOR ASSESSMENT OF NONCONFORMING LEVELS IN PARTS PER MILLION (PPM) |
MIL-PRF-38534 Revision J:2015
|
HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
IEC TR 61340-5-2:2007
|
Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
IEC 60749-27:2006+AMD1:2012 CSV
|
Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) |
IEC 62258-5:2006
|
Semiconductor die products - Part 5: Requirements for information concerning electrical simulation |
FED-STD-209 Revision E:1992
|
AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES |
IPC J STD 033C-1:2014
|
HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
IPC J STD 012 : 0
|
IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
IEC TR 62258-8:2008
|
Semiconductor die products - Part 8: EXPRESS model schema for data exchange |
IEC 61360-1:2017
|
Standard data element types with associated classification scheme - Part 1: Definitions - Principles and methods |
CLC/TR 62258-8:2008
|
Semiconductor die products - Part 8: EXPRESS model schema for data exchange |
CLC/TR 62258-3:2007
|
Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
IEEE 1076-2008 REDLINE
|
IEEE Standard VHDL Language Reference Manual |
EN 62258-6 : 2006
|
SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION |
IEC 60749-26:2013
|
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
EN 62258-5 : 2006
|
SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION |
IEC TR 62258-7:2007
|
Semiconductor die products - Part 7: XML schema for data exchange |
ISO 8879:1986
|
Information processing Text and office systems Standard Generalized Markup Language (SGML) |
IEC 62258-2:2011
|
Semiconductor die products - Part 2: Exchange data formats |
IEC TR 62258-3:2010
|
Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
ISO 14644-1:2015
|
Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration |
IEC 62258-6:2006
|
Semiconductor die products - Part 6: Requirements for information concerning thermal simulation |
ISO 9000:2015
|
Quality management systems — Fundamentals and vocabulary |
IPC J STD 028 : 0
|
PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS |
IEC 60191-4:2013
|
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
CLC/TR 62258-4:2013
|
Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
IEC TR 62258-4:2012
|
Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
EIA 557 : 2006
|
STATISTICAL PROCESS CONTROL SYSTEMS |
EN ISO 14644-1:2015
|
Cleanrooms and associated controlled environments - Part 1: Classification of air cleanliness by particle concentration (ISO 14644-1:2015) |
CLC/TR 62258-7:2007
|
Semiconductor die products - Part 7: XML schema for data exchange |