IEC 60068-2-20:2008

FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test Ta: Solderability of wire and tag terminations
  4.1 Object and general description of the test
      4.1.1 Test methods
      4.1.2 Specimen preparation
      4.1.3 Initial measurements
      4.1.4 Accelerated ageing
  4.2 Method 1: Solder bath
      4.2.1 Description of the solder bath
      4.2.2 Flux
      4.2.3 Procedure
      4.2.4 Test conditions
      4.2.5 Final measurements and requirements
  4.3 Method 2: Soldering iron at 350 degrees C
      4.3.1 Description of soldering irons
      4.3.2 Solder and flux
      4.3.3 Procedure
      4.3.4 Final measurements and requirements
  4.4 Information to be given in the relevant specification
5 Test Tb: Resistance to soldering heat
  5.1 Object and general description of the test
      5.1.1 Test methods
      5.1.2 Initial measurements
  5.2 Method 1: Solder bath
      5.2.1 Description of the solder bath
      5.2.2 Flux
      5.2.3 Procedure
      5.2.4 Test conditions
      5.2.5 De-wetting
  5.3 Method 2: Soldering iron
      5.3.1 Description of soldering iron
      5.3.2 Solder and flux
      5.3.3 Procedure
  5.4 Recovery
  5.5 Final measurements and requirements
  5.6 De-wetting (if applicable)
  5.7 Information to be given in the relevant specification
Annex A (informative) Example of apparatus for accelerated
        steam ageing process
Annex B (normative) Specification for flux constituents
Bibliography

IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following:
- the solder globule test is deleted;
- test conditions and requirements for lead-free solders are added.