BS IEC 62679-1-1:2014
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Electronic paper displays Terminology |
BS EN 61666:2010
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Industrial systems, installations and equipment and industrial products. Identification of terminals within a system |
I.S. EN 60191-6:2009
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES |
EN 60286-4:2013
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Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
BS CECC 90000:1985
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Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits |
I.S. EN 61666:2010
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INDUSTRIAL SYSTEMS, INSTALLATIONS AND EQUIPMENT AND INDUSTRIAL PRODUCTS - IDENTIFICATION OF TERMINALS WITHIN A SYSTEM |
BS EN 60191-6:2009
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Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
BS IEC 61747-1 : 1998 AMD 10788
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LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - GENERIC SPECIFICATION |
08/30179080 DC : DRAFT OCT 2008
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BS EN 61666 - INDUSTRIAL SYSTEMS, INSTALLATIONS AND EQUIPMENT AND INDUSTRIAL PRODUCTS - IDENTIFICATION OF TERMINALS WITHIN A SYSTEM |
CEI EN 61747-1 : 2004
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LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |
IEC 60286-4:2013
|
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
BS CECC 63000:1990
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Harmonized system of quality assessment for electronic components. Generic specification: film and hybrid integrated circuits |
BS CECC 64000:1990
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Harmonized system of quality assessment for electronic components: generic specification: film resistor networks |
BS EN 60191-6-2:2002
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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
05/30132036 DC : DRAFT APR 2005
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IEC 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TEST AND BURN-IN SOCKET FOR BGA, LGA, FBGA AND FLGA |
IEC 62679-1-1:2014
|
Electronic paper displays - Part 1-1: Terminology |
I.S. EN 60191-6-16:2007
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA |
IEC 60747-10:1991
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Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
IEC 60191-6-16:2007
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Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
CEI EN 61666 : 2011
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INDUSTRIELLE SYSTEME, ANLAGEN UND AUSRUESTUNGEN UND INDUSTRIEPRODUKTE - IDENTIFIKATION VON ANSCHLUESSEN IN SYSTEMEN |
12/30244653 DC : 0
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BS EN 62679-1 - ELECTRONIC PAPER DISPLAY - PART 1:TERMINOLOGY AND GENERIC SPECIFICATION |
05/30132033 DC : DRAFT APR 2005
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IEC 60191-6-13 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP TYPE SOCKET FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA) |
BS EN 60191-6-16:2007
|
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
DEFSTAN 59-62(PT5)/1(1983) : 1983
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MICROCIRCUITS ELECTRONIC (INTEGRATED CIRCUITS) - PART 5: ANALOGUE SWITCH/MULTIPLEXERS |
BS EN 61747-1:2000
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Liquid crystal and solid-state display devices Generic specification |
BS EN 60286-4:2013
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Packaging of components for automatic handling Stick magazines for electronic components encapsulated in packages of different forms |
CEI EN 60286-4 : 2014
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PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS |
I.S. EN 60286-4:2013
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PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS (IEC 60286-4:2013 (EQV)) |
CEI EN 60191-6 : 2011
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES |
IEC 60191-6:2009
|
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
IEC 61666:2010
|
Industrial systems, installations and equipment and industrial products - Identification of terminals within a system |
IEC 61747-1:1998+AMD1:2003 CSV
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Liquid crystal and solid-state display devices - Part 1: Generic specification |
IEC 60191-6-6:2001
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Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
13/30284029 DC : 0
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BS EN 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA |
CEI EN 60191-6-16 : 2008
|
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA |
BS 3934-6:1992
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Mechanical standardization of semiconductor devices Specification for the preparation of outline drawings of surface mounted semiconductor device packages |
07/30167960 DC : 0
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BS EN 60191-6 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES |
EN 61666:2010
|
Industrial systems, installations and equipment and industrial products - Identification of terminals within a system |
EN 60191-6:2009
|
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
EN 60191-6-16:2007
|
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
EN 61747-1:1999/A1:2003
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LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION |