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  • IEC 60191-3:1999

    Current The latest, up-to-date edition.

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French, Spanish, Castilian

    Published date:  29-10-1999

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    1 General
    2 Terminology and definitions
    3 Cross-referencing of packages
    4 Terminal identification - Numbering of terminals
    5 Dimensions and reference letter symbols
    6 Drawing layout
    7 Dimensioning and tolerances
    8 Inter-conversion of inch and millimetre dimensions,
          and rules for rounding-off
    9 Definition of families
    10 Examples of drawings
    11 Design procedure for dimensions of integrated circuit
          packages
    12 Rules for mounting integrated circuit packages into
          carriers
    13 Bending of terminals of QUIL packages
    14 Pin grid arrays
    15 Rule for orientation of integrated circuit packages in
          handling and shipping carriers such as stick magazines
          and rails
    Annex A (normative) Limits applicable for the dimensions of
                        integrated circuit package outlines
    Annex B (informative) Example drawings showing cross-
                          referencing of packages, utilization
                          of reference letter symbols, terminal
                          identification and index area
    Annex C (normative) Terminal identification and numbering of
                        terminals of devices with terminals
                        disposed in three or more rows in each
                        orthogonal direction
    Annex D (normative) Recommended dimensions of integrated
                        circuit packages of Form G family
    Annex E (normative) General rules for the preparation of
                        outline drawings of packages of Form G
                        intended for automated handling
    Annex F (normative) General rules for the preparation of
                        outline drawings of pin grid arrays
    Annex G (normative) Rule for orientation of integrated
                        circuit packages in handling and shipping
                        carriers such as stick magazines and rails
    Annex G (normative) Rule for orientation of integrated circuit
                        packages in handling and shipping carriers
                        such as stick magazines and rails
    Annex H (normative) Bottom view method for Terminal No 1
                        recognition
    Annex K (normative) Gate burrs, mold flash and protrusions

    Abstract - (Show below) - (Hide below)

    Gives guidance on the preparation of drawings of integrated circuits outlines.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47D
    Development Note Also numbered as BS EN 60191-3. (09/2005) Stability Date: 2018. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS IEC 62679-1-1:2014 Electronic paper displays Terminology
    BS EN 61666:2010 Industrial systems, installations and equipment and industrial products. Identification of terminals within a system
    I.S. EN 60191-6:2009 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
    EN 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
    BS CECC 90000:1985 Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits
    I.S. EN 61666:2010 INDUSTRIAL SYSTEMS, INSTALLATIONS AND EQUIPMENT AND INDUSTRIAL PRODUCTS - IDENTIFICATION OF TERMINALS WITHIN A SYSTEM
    BS EN 60191-6:2009 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    BS IEC 61747-1 : 1998 AMD 10788 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - GENERIC SPECIFICATION
    08/30179080 DC : DRAFT OCT 2008 BS EN 61666 - INDUSTRIAL SYSTEMS, INSTALLATIONS AND EQUIPMENT AND INDUSTRIAL PRODUCTS - IDENTIFICATION OF TERMINALS WITHIN A SYSTEM
    CEI EN 61747-1 : 2004 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
    IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
    BS CECC 63000:1990 Harmonized system of quality assessment for electronic components. Generic specification: film and hybrid integrated circuits
    BS CECC 64000:1990 Harmonized system of quality assessment for electronic components: generic specification: film resistor networks
    BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
    05/30132036 DC : DRAFT APR 2005 IEC 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TEST AND BURN-IN SOCKET FOR BGA, LGA, FBGA AND FLGA
    IEC 62679-1-1:2014 Electronic paper displays - Part 1-1: Terminology
    I.S. EN 60191-6-16:2007 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA
    IEC 60747-10:1991 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
    IEC 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
    CEI EN 61666 : 2011 INDUSTRIELLE SYSTEME, ANLAGEN UND AUSRUESTUNGEN UND INDUSTRIEPRODUKTE - IDENTIFIKATION VON ANSCHLUESSEN IN SYSTEMEN
    12/30244653 DC : 0 BS EN 62679-1 - ELECTRONIC PAPER DISPLAY - PART 1:TERMINOLOGY AND GENERIC SPECIFICATION
    05/30132033 DC : DRAFT APR 2005 IEC 60191-6-13 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP TYPE SOCKET FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA)
    BS EN 60191-6-16:2007 Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
    DEFSTAN 59-62(PT5)/1(1983) : 1983 MICROCIRCUITS ELECTRONIC (INTEGRATED CIRCUITS) - PART 5: ANALOGUE SWITCH/MULTIPLEXERS
    BS EN 61747-1:2000 Liquid crystal and solid-state display devices Generic specification
    BS EN 60286-4:2013 Packaging of components for automatic handling Stick magazines for electronic components encapsulated in packages of different forms
    CEI EN 60286-4 : 2014 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS
    I.S. EN 60286-4:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS (IEC 60286-4:2013 (EQV))
    CEI EN 60191-6 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    IEC 61666:2010 Industrial systems, installations and equipment and industrial products - Identification of terminals within a system
    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
    13/30284029 DC : 0 BS EN 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA
    CEI EN 60191-6-16 : 2008 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA
    BS 3934-6:1992 Mechanical standardization of semiconductor devices Specification for the preparation of outline drawings of surface mounted semiconductor device packages
    07/30167960 DC : 0 BS EN 60191-6 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
    EN 61666:2010 Industrial systems, installations and equipment and industrial products - Identification of terminals within a system
    EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
    EN 61747-1:1999/A1:2003 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
    ISO 2692:2014 Geometrical product specifications (GPS) Geometrical tolerancing Maximum material requirement (MMR), least material requirement (LMR) and reciprocity requirement (RPR)
    IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
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