Skip to content
Please enter a keyword to search

  • IEC 60194:2015

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    Printed board design, manufacture and assembly - Terms and definitions

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  13-12-2017

    Language(s):  English - French

    Published date:  15-04-2015

    Publisher:  International Electrotechnical Committee

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 A
    5 B
    6 C
    7 D
    8 E
    9 F
    10 G
    11 H
    12 I
    13 J
    14 K
    15 L
    16 M
    17 N
    18 O
    19 P
    20 Q
    21 R
    22 S
    23 T
    24 U
    25 V
    26 W
    27 X
    28 Y
    29 Z
    Annex A (informative) - Principles and use of the
            classification code
    Annex B (informative) - Abbreviations
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 60194:2015 defines the terminology used in the field of printed circuit boards and printed circuit board assembly products. The main changes with respect to the previous edition are the following:
    - Some two hundred terms and definitions have been updated, where applicable, and
    - another two hundred new terms and definitions have been added.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Stability date: 2022. (04/2015)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 60249-1:1993 Base materials for printed circuits Base materials for printed circuits. Test methods
    BS EN 61249-2-39:2013 Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    07/30174325 DC : 0 BS EN 61249-2-41 - MATERIALS FOR PRINTED CIRCUIT BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EXPOIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 62137-3:2012 Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
    CEI EN 62137-1-4 : 2010 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
    I.S. EN 62137-1-5:2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
    11/30253280 DC : 0 BS EN 62326-20 ED.1 - ELECTRONIC CIRCUIT BOARD FOR HIGH-BRIGHTNESS LEDS
    BS EN 60603-2:1998 Connectors for frequencies below 3 MHz for use with printed boards Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features
    PD IEC/TS 62878-2-1:2015 Device embedded substrate Guidelines. General description of technology
    BS EN 61249-4-15:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    09/30211071 DC : 0 BS EN 61249-2-30 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXCIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINMATE OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61182-2-2:2012 Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
    BS EN 61249-2-26:2005 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    BS EN 61249-2-23:2005 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
    02/211157 DC : DRAFT DEC 2002 IEC 61249-4-12 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
    07/30164989 DC : 0 EN 61249-2-36 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-36: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    06/30153524 DC : DRAFT JULY 2006 EN 62137-1-3 - SURFACE-MOUNT TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
    07/30164973 DC : 0 EN 61249-2-31 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-31: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 4.1 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    07/30164993 DC : 0 EN 61249-2-37 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    03/107475 DC : 0 IEC 61249-6-3 ED.1.0 - MATERIALS FOR INTERCONNECTION STRUCTURES - PART 6-3: SECTIONAL SPECIFICATION FOR REINFORCEMENTS - WOVEN FIBREGLASS FABRICS
    BS EN 61249-4-19:2013 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    06/30153520 DC : DRAFT JULY 2006 EN 62468 - THE MARKING FOR PRESENCE AND ABSENCE OF THE SPECIFIED CHEMICAL SUBSTANCE IN MATERIALS, COMPONENTS AND MOUNTED BOARDS IN ELECTRICAL AND ELECTRONIC EQUIPMENT
    BS 123400-003:2001 System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
    05/30133599 DC : DRAFT MAY 2005 IEC 62137-1-2 - SURFACE MOUNT TECHNOLOGY - ENVIRONMENTAL ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
    CEI EN 61249-2-39 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-39: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE EPOXIDE AND NON-EPOXIDE, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies General
    BS 9761:1977 Specification for printed circuits of assessed quality: sectional specification for multilayer printed circuits
    BS EN 61249-2-43:2016 Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    BS EN 61188-5-1:2002 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Attachment (land/joint) considerations. Generic requirements
    BS PD ISO/IEC PAS 60127-8 : 2014 MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
    07/30164985 DC : 0 BS EN 61249-2-34 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-34: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - NON-HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 3.7 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    07/30169763 DC : 0 BS EN 62515 - EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA
    CEI EN 61249-2-2 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-2: REINFORCED BASE MATERIALS, CLAD AND UNCLAD PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEETS, HIGH ELECTRICAL GRADE, COPPER-CLAD
    BS EN 123200:1992 Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes
    15/30331587 DC : 0 BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    BS 123800:2001 System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
    02/206695 DC : DRAFT JUN 2002 IEC 61249-2-1. ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES - PART 2-1: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEET, ECONOMIC GRADE, COPPER CLAD
    CEI EN 61249-2-5 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 2-5: REINFORCED BASE MATERIALS, CLAD AND UNCLAD BROMINATED EPOXIDE CELLULOSE PAPER REINFORCED CORE / WOVEN E-GLASS REINFORCED SURFACES LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61249-2-2:2005 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
    BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
    I.S. EN 62739-3:2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS
    BS EN 61249-2-8:2003 Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Reinforced base materials clad and unclad. Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    03/100395 DC : DRAFT APR 2003 EN 175101-809 - DETAIL SPECIFICATION - TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2,54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75 101-801, WITH ASSESSED QUALITY
    BS 123100:2001 System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes
    IEC 61249-2-5:2003 Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
    EN IEC 61249-2-47:2018 Materials for printed boards and other interconnecting structures – Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    IEC 60326-3:1991 Printed boards - Part 3: Design and use of printed boards
    CEI EN 61760-1 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    CEI EN 61249-4-11 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 62137-1-4:2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
    I.S. EN 61193-1:2002 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
    I.S. EN 61249-2-22:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    I.S. EN 62326-20:2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
    I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
    IEC 62090:2017 Product package labels for electronic components using bar code and two-dimensional symbologies
    CEI EN 61249-2-40 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE, MODIFIED, NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-2-2:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-2: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEETS, HIGH ELECTRICAL GRADE, COPPER-CLAD
    CEI EN 61249-4-12 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    CEI EN 61249-2-11 : 2005 MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-11: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES RENFORCEES EN POLYIMIDE ET TISSU DE VERRE DE TYPE E EPOXYDE BROME MODIFIE OU NON MODIFIE, D'INFLAMMABILITE DEFINIE (ESSAI DE COMBUSTION VERTICALE), PLAQUEES CUIVRE
    I.S. EN 61249-2-44:2016 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-44: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-2-30:2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINATE OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD (IEC 61249-2-30:2012 (EQV))
    I.S. EN 123100:1994 SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES
    IEC 60249-3-3:1991 Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
    IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
    I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    BS EN 16602-70-10:2015 Space product assurance. Qualification of printed circuit boards
    BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
    IEC 61249-2-1:2005 Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
    IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
    IEC 62326-1:2002 Printed boards - Part 1: Generic specification
    IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    EN 62326-1:2002 Printed boards - Part 1: Generic specification
    EN 61189-11 : 2013 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS
    EN 61249-4-5:2005 Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
    EN 123600:1996 Sectional Specification: Flex-rigid multilayer printed boards with through connections
    EN 61249-2-37:2009 Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    EN 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
    EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    EN 160100 : 1997 CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OFASSESSED QUALITY (SECTIONAL SPECIFICATION)
    EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
    EN 61249-2-43:2016 Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    EN 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
    EN 60127-4:2005/A2:2013 Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
    EN 61189-2-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
    EN 61249-4-19:2013 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 61249-4-15 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    EN 61249-2-1:2005 Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
    EN 62090:2017 Product package labels for electronic components using bar code and two- dimensional symbologies
    EN 62137-1-3:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
    EN 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
    EN 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
    EN 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
    EN 123300 : 1992 AMD 1 1995 SECTIONAL SPECIFICATION: MULTILAYER PRINTED BOARDS
    EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    EN 61249-2-26:2005 Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    EN 61249-2-44:2016 Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    EN 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
    EN 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    EN 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
    EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    I.S. EN 61249-2-6:2005/AC:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    CEI EN 61249-2-37 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 61249-4-18:2013 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 61249-4-16:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 61249-2-1:2005 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
    02/210157 DC : DRAFT OCT 2002 IEC 61249-2-23 ED.1 - MATERIALS FOR INTERCONNECTION STRUCTURES - PART 2-23: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - SECTION 23: NON-HALOGENATED PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEET, ECONOMIC GRADE, COPPER CLAD
    I.S. EN 61249-2-23:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-23: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS, ECONOMIC GRADE, COPPER-CLAD
    05/30133278 DC : DRAFT MAY 2005 IEC 62137-1-1 - SURFACE MOUNT TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
    BS EN 61249-2-6:2003 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    DIN EN 60097:1993-09 Grid systems for printed circuits (IEC 60097:1991); German version EN 60097:1993
    CEI EN 61249-4-16 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    I.S. EN 16602-70-11:2015 SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS
    11/30252859 DC : 0 BS EN 61189-3-913 ED.1 - TEST METHODS FOR ELECTRONIC CIRCUIT BOARD FOR HIGH-BRIGHTNESS LEDS
    BS EN 61249-2-42:2010 Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    BS EN 61249-4-12:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
    BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
    BS EN 61249-4-5:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability
    01/205138 DC : 0 IEC 61249-4-1 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - SECTION 1: EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    09/30206176 DC : DRAFT JUNE 2009 BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
    CEI EN 62137-1-5 : 2010 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
    BS CECC 23300-800(1990) : AMD 7366 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: CAPABILITY DETAIL SPECIFICATION; MULTILAYER PRINTED BOARDS
    BS EN 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys
    BS EN 62326-1:2002 Printed boards Generic specification
    12/30254697 DC : 0 BS ISO 16525-9 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 9: DETERMINATION OF HIGH-SPEED SIGNAL-TRANSMISSION CHARACTERISTICS
    BS 6221-11:1991 Printed wiring boards Specification for flex-rigid multilayer printed boards with through connections
    07/30165180 DC : 0 BS EN 60068-2-83 - ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF - SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING LEAD-FREE SOLDER PASTE
    BS 123100-003:2001 System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
    11/30243259 DC : 0 BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    BS CECC23100-800(1990) : AMD 7360 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: CAPABILITY DETAIL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES
    17/30352677 DC : 0 BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN
    NF EN 61191-6 : 2010 PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD
    BS EN 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
    I.S. EN 61249-2-43:2016 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
    BS 9760:1977 Specification for printed circuits of assessed quality: generic data and methods of test: capability approval procedure and rules
    EN IEC 61249-2-46:2018 Materials for printed boards and other interconnecting structures – Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    BS EN 61249-2-10:2003 Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    BS CECC23300(1989) : 1989 AMD 7364 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: MULTILAYER PRINTED BOARDS
    I.S. EN 61249-2-1:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-1: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS, ECONOMIC GRADE, COPPER CLAD
    I.S. EN 61193-3:2013 QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING (IEC 61193-3:2013 (EQV))
    BS EN 60068-2-83:2011 Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
    14/30314209 DC : 0 BS EN 61189-2-719 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-719: TEST METHODS FOR PRINTED BOARD AND ASSEMBLY MATERIALS - RELATIVE PERMITTIVITY AND LOSS TANGENT (500 MHZ TO 10 GHZ)
    NF EN 62137-1-5 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
    02/207116 DC : DRAFT JUN 2002 IEC 61249-2-2. ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES - PART 2-2: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE, HIGH ELECTRICAL GRADE, COPPER CLAD
    BS ISO 16525-9:2014 Adhesives. Test methods for isotropic electrically conductive adhesives Determination of high-speed signal-transmission characteristics
    BS EN 160100:1998 Harmonized system of quality assessment for electronic components. Sectional specification: capability approval of manufacturers of printed board assemblies of assessed quality
    BS EN 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
    BS EN 61249-2-30:2013 Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
    BS EN 61249-2-21:2003 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    BS EN 61249-2-40:2013 Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    BS EN 62137-1-5:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
    CEI EN 62739-1 : 2014 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING
    BS EN 61249-2-37:2009 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    09/30186180 DC : 0 BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    CEI EN 61249-2-23 : 2005 MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-23: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES RENFORCEES DE PAPIER CELLULOSE PHENOLIQUE NON HALOGENE, DE QUALITE ECONOMIQUE, PLAQUEES CUIVRE
    BS 5830:1979 Specification for grid system for printed circuits
    BS EN 61249-2-9:2003 Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Reinforced base materials clad and unclad. Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    BS EN 61249-2-5:2003 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
    RC.AERO 54402 : 1975 QUALITY CONTROL PROCEDURE FOR SINGLE-LAYER SCREEN PRINTED ON CERAMIC SUBSTRATES
    I.S. EN 61249-2-8:2003 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-8: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED BROMINATED EPOXIDE WOVEN FIBREGLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    CEI EN 61249-2-30 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    IEC TR 60664-2-1:2011 Insulation coordination for equipment within low-voltage systems - Part 2-1: Application guide - Explanation of the application of the IEC 60664 series, dimensioning examples and dielectric testing
    NF EN 61193-3 : 2013 QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING
    IEC 61249-2-45:2018 Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    CEI EN 61249-2-22 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    IEC 61249-2-11:2003 Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    IEC 60097:1991 Grid systems for printed circuits
    I.S. EN 61249-2-36:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-36: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 61192-3:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
    I.S. EN 16602-70-10:2015 SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS
    I.S. EN 60603-2:1998 CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 2: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS WITH ASSESSED QUALITY, FOR PRINTED BOARDS, FOR BASIC GRID OF 2,54 MM (0,1 IN) WITH COMMON MOUNTING FEATURES
    CEI EN 61189-2-719 : 1ED 2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-719: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES - RELATIVE PERMITTIVITY AND LOSS TANGENT (500 MHZ TO 10 GHZ)
    IEC 61190-1-3:2017 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
    CEI EN 61249-2-35 : 2010 MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-35: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES EN TISSU DE VERRE DE TYPE E EPOXYDE MODIFIE, PLAQUEES CUIVRE, D'INFLAMMABILITE DEFINIE (ESSAI DE COMBUSTION VERTICALE) POUR LES ASSEMBLAGES SANS PLOMB
    CEI EN 62878-1-1 : 2016 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    CEI EN 61249-4-14 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    I.S. EN 61193-2:2007 QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES
    I.S. EN 123300:1994 SECTIONAL SPECIFICATION: MULTILAYER PRINTED BOARDS
    I.S. EN 61249-4-12:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 62739-2:2016 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING
    I.S. EN 61189-2-719:2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-719: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES - RELATIVE PERMITTIVITY AND LOSS TANGENT (500 MHZ TO 10 GHZ)
    CEI EN 61249-2-41 : 2011 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-2-39:2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-39: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE EPOXIDE AND NON-EPOXIDE, WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY (IEC 61249-2-39:2012 (EQV))
    BS EN 60127-4 : 2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
    I.S. EN 62137-1-2:2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
    I.S. EN 60664-3:2017 INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
    CEI EN 60068-2-58 : 2016 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    I.S. EN IEC 61249-2-45:2018 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-45: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NONHALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY (1.0W/M K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    IEC PAS 62137-3:2008 Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
    I.S. EN 60068-2-83:2011 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV))
    I.S. EN 61249-2-9:2003 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    I.S. EN 61249-2-35:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    IPC 1756 : 2010 MANUFACTURING PROCESS DATA MANAGEMENT
    I.S. EN 123500:1994 SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
    I.S. EN 61249-2-38:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-4-1:2008 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 61189-3-719:2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING
    I.S. EN IEC 61190-1-3:2018 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    IEC TR 61189-3-914:2017 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
    IEC 61249-2-21:2003 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    I.S. EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    IEC 61249-2-31:2009 Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
    I.S. EN 61190-1-3:2007 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    IEC 61182-1:1994 Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form
    IEC 60664-3:2016 RLV Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
    IEC 61249-2-9:2003 Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    DD IEC/PAS 61249-3-1:2007 Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
    IEC 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    IEC 61249-4-14:2009 Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    IEC 62137-1-3:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
    IEC 61249-4-5:2005 Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
    IEC 61249-2-26:2005 Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
    EN 61760-3:2010 Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
    OVE/ONORM EN 61760-1 : 2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    BS EN 60603-3:1998 Connectors for frequencies below 3 MHz for use with printed boards Two-part connectors for printed boards having contacts spaced at 2,54 mm (0,100 in) centres and staggered terminations at that same spacing
    09/30179135 DC : 0 BS EN 61249-2-42 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROAMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    EN IEC 61249-2-45:2018 Materials for printed boards and other interconnecting structures – Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    EN 60664-3:2017 Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
    BS EN 60068-2-58 : 2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    07/30164977 DC : 0 EN 61249-2-32 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-32: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 3.7 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    07/30164981 DC : 0 EN 61249-2-33 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-33: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - NON-HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 4.1 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    I.S. EN 62739-1:2013 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013 (EQV))
    BS EN 61249-2-35:2009 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    BS EN 61193-2:2007 Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
    17/30355504 DC : 0 BS EN 61189-2-630 ED.1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-630: TEST METHODS FOR BASE MATERIALS FOR RIGID PRINTED BOARDS - MOISTURE ABSORPTION AFTER PRESSURE VESSEL CONDITIONING
    15/30318681 DC : 0 BS EN 61190-1-3 ED 3.0 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    BS EN 60603-4:1998 Connectors for frequencies below 3 MHz for use with printed boards Two-part connectors for printed boards having contacts spaced at 1,91 mm (0,075 in) centres and staggered terminations at that same spacing
    BS EN 61249-2-38:2009 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    02/211156 DC : DRAFT DEC 2002 IEC 61249-4-11 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
    DD IEC PAS 62137-3 : DRAFT 2008 ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
    14/30312344 DC : 0 PD IEC/PAS 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
    I.S. EN 61249-4-15:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    IEC 61249-2-32:2009 Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
    BS 123000:2001 System of quality assessment. Generic specification. Printed boards
    BS EN 61189-2-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)
    BS 123400:2001 System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards without through-connections
    CEI 109-5 : 2011 INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 2-1: APPLICATION GUIDE - EXPLANATION OF THE APPLICATION OF THE IEC 60664 SERIES, DIMENSIONING EXAMPLES AND DIELECTRIC TESTING
    PD IEC/TR 61189-3-914:2017 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
    IEC 61249-2-40:2012 Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    BS EN 61249-4-17:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 61190-1-2:2014 Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly
    BS EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies Terminal assemblies
    BS EN 123500:1992 Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections
    BS EN 61249-4-1:2008 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
    07/30164961 DC : 0 BS EN 61249-4-15 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    07/30169578 DC : 0 BS EN 61188-7 - PRINTED BOARD AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: SECTIONAL REQUIREMENTS - ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION
    NF EN 60068-2-83 : 2012 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
    BS EN 62137-1-2:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
    05/30133283 DC : DRAFT MAY 2005 IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    BS EN 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
    BS 123700-003:2001 System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
    BS EN 123100:1992 Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes
    BS 123600:2001 System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
    BS 6221-6:1982 Printed wiring boards Specification for multilayer printed wiring boards
    BS EN 62090:2017 Product package labels for electronic components using bar code and two- dimensional symbologies
    07/30164965 DC : 0 BS EN 61249-4-16 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    10/30235541 DC : 0 BS EN 61249-4-19 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPEG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS EN 62137-1-1:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
    BS EN 61760-1:2006 Surface mounting technology Standard method for the specification of surface mounting components (SMDs)
    BS EN 61760-3:2010 Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering
    13/30284118 DC : 0 BS EN 61249-2-44 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-44: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS 6221-5:1982 Printed wiring boards Specification for single and double sided rigid printed boards with plated-through holes
    I.S. EN 61182-2-2:2012 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV))
    I.S. EN 61191-6:2010 PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD
    16/30338234 DC : 0 BS EN 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
    IEC 60326-9:1991 Printed boards - Part 9: Specification for flexible multilayer printed boards with through connections
    16/30336979 DC : 0 BS EN 60664-3 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
    BS 6221-7:1982 Printed wiring boards Method for specifying single and double sided flexible printed wiring boards without through connections
    BS EN 60068-2-77:1999 Environmental testing. Test methods Body strength and impact shock
    PD IEC/TS 62878-2-3:2015 Device embedded substrate Guidelines. Design guide
    BS CECC23100(1989) : 1989 AMD 7358 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES
    BS EN 61193-3:2013 Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
    IEC 61249-2-34:2009 Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
    I.S. EN 61249-2-41:2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 61190-1-3 : 2007 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    I.S. EN 61190-1-2:2014 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    I.S. EN 123000:1994 GENERIC SPECIFICATION: PRINTED BOARDS
    IEC 61189-2-630:2018 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
    IEC PAS 61249-3-1:2007 Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
    CEI EN 62326-1 : 2002 PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
    IPC 1752 : A-2 MATERIALS DECLARATION MANAGEMENT
    CEI EN 60068-2-77 : 2001 ENVIRONMENTAL TESTING - PART 2-77: TESTS BODY STRENGTH AND IMPACT SHOCK
    IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
    NF EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    IEC 60571-1:1990 Electronic equipment used on rail vehicles. Part 1: General requirements and tests for electronic equipment
    CEI EN 60068-2-83 : 2012 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
    IEC 60321-3:1990 Auxiliary printed board information. Part 3: Guidelines for artwork
    IEC 61249-2-33:2009 Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
    I.S. EN 60068-2-77:1999 ENVIRONMENTAL TESTING - PART 2-77: TESTS - TEST 77: BODY STRENGTH AND IMPACT SHOCK
    NF EN 62090 : 2003 PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
    EN 175101-809:2004/corrigendum Jun. 2005 DETAIL SPECIFICATION: TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2,54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75 101-801, WITH ASSESSED QUALITY
    IEC 61249-4-19:2013 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
    BS EN 61191-4:2017 Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
    IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types
    IEC 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
    IEC 62137-4:2014 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
    IEC 60068-2-83:2011 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
    IEC 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    IEC 61249-2-41:2010 Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    UNE-EN 60664-3:2004 Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
    EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    BS 6221-4:1982 Printed wiring boards Method for specifying single and double sided printed wiring boards with plain holes
    BS 6221-3:1991 Printed wiring boards Guide for the design and use of printed wiring boards
    BS 6221-3:1984 Printed wiring boards Guide for the design and use of printed wiring boards
    OVE/ONORM EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    EN 60249-1 : 1993 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS
    BS 6221-2:1991 Printed wiring boards Methods of test
    CEI EN 61249-4-19 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HICH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    10/30235537 DC : 0 BS EN 61249-4-18 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPEG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPEG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS EN 61249-2-22:2005 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
    BS 4584-103.3:1992 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
    CEI EN 61249-2-21 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-21: REINFORCED BASE MATERIALS, CLAD AND UNCLAD NON-HALOGENATED EPOXIDE WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 60603-9:1998 Connectors for frequencies below 3 MHz for use with printed boards Two-part connectors for printed boards, backpanels and cable connectors, basic grid of 2,54 mm (0,1 in)
    BS 123500:2001 System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
    BS 123700:2001 System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections
    96/204228 DC : DRAFT APR 1996 IEC 61182-10 - PRINTED BOARD ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 10: ELECTRONIC DATA HIERARCHY
    CEI EN 60097 : 1998 GRID SYSTEMS FOR PRINTED CIRCUITS
    IEC 60664-3 REDLINE : 3ED 2016 INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
    BS 123200:2001 System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
    CEI EN 61249-4-17 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    96/205776 DC : DRAFT MAY 1996 BS CECC 200021 - PROCESS ASSESSMENT SCHEDULE FOR MASS LAMINATION PANELS
    09/30210900 DC : 0 BS EN 61249-2-40 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE, MODIFIED, NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 61182-7:1996 Printed boards. Electronic data description and transfer Bare board electric test information in digital form
    BS 123500-003:2001 System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
    CEI EN 62137-1-3 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
    I.S. EN 61249-4-16:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    CEI EN 61249-2-1 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-1: REINFORCED BASE MATERIALS, CLAD AND UNCLAD PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS,ECONOMIC GRADE, COPPER CLAD
    BS 123800-003:2001 System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
    CEI EN 61249-4-15 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    RC.AERO 54406 : 1978 REPAIR AND MODIFICATION OF PRINTED WIRING BOARDS FOR AEROSPACE USE
    DIN IEC 60326-4:1993-09 PRINTED BOARDS - PART 4: SPECIFICATION FOR SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES
    EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    09/30201049 DC : 0 BS EN 61249-2-41 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASED MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 61191-6:2010 Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
    BS EN 175101-802:2000 Harmonized system of quality assessment for electronic components. Detail specification Two-part connectors for printed boards for high number of contacts with basic grid of 2,54 mm on 3 or 4 rows
    I.S. EN IEC 61249-2-46:2018 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-46: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY (1.0W/M K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS CECC23000(1989) : 1989 AMD 7145 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERAL SPECIFICATION: PRINTED BOARDS
    BS EN 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
    13/30284114 DC : 0 BS EN 61249-2-43 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGEN EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 62137-1-4:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
    09/30201707 DC : 0 BS EN 60664-3+A1 ED.2 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
    CEI EN 61189-5-503 : 1ED 2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    BS EN 61190-1-1:2002 Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    07/30164997 DC : 0 EN 61249-2-38 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS CECC23500(1990) : 1990 AMD 7369 SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
    BS EN 61249-2-11:2003 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    BS EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies
    BS CECC23200(1989) : 1989 AMD 7361 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED THROUGH HOLES
    14/30317095 DC : 0 BS EN 62739-2 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING
    BS EN 61249-2-41:2010 Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    BS EN 123000:1992 Harmonized system of quality assessment for electronic components. Generic specification: printed boards
    BS EN 123400:1992 Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections
    PD IEC/TS 62878-2-4:2015 Device embedded substrate Guidelines. Test element groups (TEG)
    BS CECC23400(1990) : 1990 AMD 7367 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS
    07/30153508 DC : 0 BS EN 61249-2-35 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    02/210156 DC : DRAFT OCT 2002 IEC 61249-2-26 ED.1 - MATERIALS FOR INTERCONNECTION STRUCTURES - PART 2-26: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - SECTION 26: NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    09/30211075 DC : 0 BS EN 61249-2-39 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-39: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE EPOXCIDE AND NON-EPOXICDE, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS 6221-9:1991 Printed wiring boards Specification for flexible multilayer boards with through connections
    BS EN 60068-2-20:2008 Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads
    BS CECC23200-800(1990) : AMD 7363 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: CAPABILITY DETAIL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES
    02/211158 DC : DRAFT DEC 2002 IEC 61249-4-5 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
    09/30178203 DC : 0 BS EN 61193-3, ED.1 - QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING
    IEC 61249-2-10:2003 Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    05/30133287 DC : DRAFT MAY 2005 IEC 61190-1-3 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    BS 123600-003:2001 System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
    CEI EN 61249-2-26 : 2005 MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-26: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES RENFORCEES EN TISSU DE VERRE DE TYPE EPOXYDE TISSE/NON TISSE, NON-HALOGENE, D'INFLAMMABILITE DEFINIE (ESSAI DE COMBUSTION VERTICALE), PLAQUEES CUIVRE
    NF EN 62137-1-4 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
    I.S. EN 62090:2017 PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
    CEI EN 61249-2-42 : 2011 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN / WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 61182-7:1998 PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM
    I.S. EN 61760-3:2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    I.S. EN IEC 61249-2-47:2018 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-47: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY (2.0W/M K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    NF EN 62137-1-3 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
    CEI EN 61191-4 : 2005 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    I.S. EN 61192-2:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES
    I.S. EN 60068-2-20:2008 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    CEI EN 62137-1-1 : 2008 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
    I.S. EN 61249-4-19:2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-4-17:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    NF EN 61190-1-3 : 2008 AMD 1 2010 Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications
    IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
    I.S. EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES
    I.S. EN 62137-1-3:2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
    IEC 61249-2-47:2018 Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    I.S. EN 61188-5-1:2002 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
    IEC 60326-10:1991 Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections
    IEC 60326-11:1991 Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections
    I.S. EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61249-2-35:2008 Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    BS 123200-003:2001 System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
    IEC 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
    IEC 61189-2-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
    IEC 61191-6:2010 Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
    ISO 16525-9:2014 Adhesives Test methods for isotropic electrically conductive adhesives Part 9: Determination of high-speed signal-transmission characteristics
    IEC 61249-2-30:2012 Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
    IEC 61249-2-37:2008 Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    IEC 61249-2-44:2016 Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    IEC 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
    BS 123300-003:2001 System of quality assessment. Capability detail specification. Rigid multilayer printed boards
    15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    IEC 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
    IEC 60068-2-77:1999 Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
    PD IEC/TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
    11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    IEC 61249-2-22:2005 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
    IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
    IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    IEC 61249-4-15:2009 Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    IEC 61249-2-36:2008 Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    IEC 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
    IEC 61192-5:2007 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
    IEC 61249-2-42:2010 Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
    IEC 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
    IEC 61249-4-12:2005 Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
    IEC 61249-2-39:2012 Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
    IEC 61249-2-23:2005 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
    IEC 62137-3:2011 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
    IEC 61249-2-8:2003 Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    IEC 61249-2-38:2008 Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    IEC 61760-3:2010 Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
    IEC 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
    IEC 61182-7:1995 Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    12/30262664 DC : DRAFT APR 2012 BS EN 62588 - MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    BS IEC 61182-2:2006 Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements
    IEC 61249-4-1:2008 Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
    EN 61182-7 : 1995 PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM
    EN 62137-1-1 : 2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
    EN 62739-1 : 2013 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013)
    EN 16602-70-10:2015 Space product assurance - Qualification of printed circuit boards
    EN 16602-70-11:2015 Space product assurance - Procurement of printed circuit boards
    02/211159 DC : DRAFT DEC 2002 IEC 61249-4-2 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-2: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
    BS EN 62137-1-3:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
    I.S. EN 61249-2-37:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    IEC 61192-3:2002 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
    PD IEC/TR 60664-2-1:2011 Insulation coordination for equipment within low-voltage systems Application guide. Explanation of the application of the IEC 60664 series, dimensioning examples and dielectric testing
    BS EN 61249-2-36:2009 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    BS EN 62137-4:2014 Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
    BS EN 61193-1:2002 Quality assessment systems Registration and analysis of defects on printed board assemblies
    I.S. EN 62137-4:2014 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
    CEI EN 61249-2-38 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    CEI EN 61249-4-1 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    CEI EN 61249-2-6 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61249-4-14:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 60603-10:1998 Connectors for frequencies below 3 MHz for use with printed boards Two-part connectors for printed boards for basic grid of 2,54 mm (0,1 in), inverted type
    BS EN 60603-8:1998 Connectors for frequencies below 3 MHz for use with printed boards Two-part connectors for printed boards for basic grid of 2,54 mm (0,1 in), with square male contacts of 0,63 mm x 0,63 mm
    BS EN 61192-5:2007 Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies
    I.S. EN 61249-4-11:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    04/30123452 DC : DRAFT OCT 2004 IEC 61249-2-22 ED 1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED NONHALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies Surface-mount assemblies
    CEI EN 62137-1-2 : 2008 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
    CEI EN 62137-3 : 2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
    07/30164957 DC : 0 BS EN 61249-4-14 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS 123300:2001 System of quality assessment. Sectional specification. Rigid multilayer printed boards
    BS 6221-8:1982 Printed wiring boards Method for specifying single and double sided flexible printed wiring boards with through connections
    BS 6221-10:1991 Printed wiring boards Specification for flex-rigid double-sided printed boards with through connections
    07/30164969 DC : 0 EN 61249-4-17 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    IEC 61249-2-46:2018 Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    I.S. EN 61249-2-42:2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-4-14:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    IEC 61189-3-913:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
    I.S. EN 60249-1:1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS
    I.S. EN 61249-2-26:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-26: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    I.S. EN 61189-11:2013 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS (IEC 61189-11:2013 (EQV))
    BS EN 175101-809:2004 Harmonized system of quality assessment for electronic components. Detail specification Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality
    12/30258438 DC : 0 BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    16/30333617 DC : 0 BS EN 62090 - PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
    05/30138801 DC : DRAFT SEP 2005 IEC 60068-2-20 ED 5 - BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2-20: TEST - TEST T - TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF LEADED DEVICES
    BS EN 61249-4-11:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability
    EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
    IEC 61249-2-6:2003 Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    I.S. EN 61249-4-18:2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    I.S. EN 160100:1998 CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OFASSESSED QUALITY (SECTIONAL SPECIFICATION)
    I.S. EN 62137-1-1:2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
    I.S. EN 62137-3:2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV))
    I.S. EN 60097:1993 GRID SYSTEMS FOR PRINTED CIRCUITS
    I.S. EN 60127-4:2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV))
    I.S. EN 61249-2-40:2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE, NONHALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY (IEC 61249-2-40:2012 (EQV))
    I.S. EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    BS EN 60664-3:2017 Insulation coordination for equipment within low-voltage systems Use of coating, potting or moulding for protection against pollution
    I.S. EN 61249-4-5:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    CEI EN 61249-2-36 : 2010 MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-36: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES EN TISSU DE VERRE DE TYPE E EPOXYDE, PLAQUEES CUIVRE, D'INFLAMMABILITE DEFINIE (ESSAI DE COMBUSTION VERTICALE) POUR LES ASSEMBLAGES SANS PLOMB
    CEI EN 61249-4-18 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    CEI EN 61249-4-5 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 61189-5-503:2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    BS EN 123300:1992 Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
    IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
    CEI EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    CEI EN 61249-2-8 : 2004 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-8: REINFORCED BASE MATERIALS CLAD AND UNCLAD MODIFIED BROMINATED EPOXIDE WOVEN FIBERGLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    CEI EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    I.S. EN 62326-1:2002 PRINTED BOARDS - GENERIC SPECIFICATION
    I.S. EN 123200:1994 SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES
    IEC 60664-3:2016 Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
    I.S. EN 61249-2-21:2004 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-21: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    I.S. EN 175101-809:2004 DETAIL SPECIFICATION - TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2.54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75101-801, WITH ASSESSED QUALITY
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    I.S. EN 60068-2-58:2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    I.S. EN 61190-1-1:2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    I.S. EN 61249-2-11:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-11: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - POLYIMIDE, BROMINATED EPOXIDE MODIFIED OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    EN 60068-2-77:1999 Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
    EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
    IEC 61249-4-18:2013 Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    IEC 61249-4-17:2009 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 16602-70-11:2015 Space product assurance. Procurement of printed circuit boards
    IEC 61249-2-43:2016 Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    IEC 60603-2:1995 Connectors for frequencies below 3 MHz for use with printed boards - Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features
    IEC 61249-2-2:2005 Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 61249-4-11:2005 Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
    EN 61193-1:2002 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
    EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    EN 62137-3:2012 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
    EN 60603-2:1998/A1:2005 CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 2: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS WITH ASSESSED QUALITY, FOR PRINTED BOARDS, FOR BASIC GRID OF 2,54 MM (0,1 IN) WITH COMMON MOUNTING FEATURES
    EN 61249-2-21:2003 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    EN 175101-802:1999 Detail specification: Two-part connectors for printed boards for high number of contacts with basic grid of 2,54 mm on 3 or 4 rows
    EN 61249-2-6:2003/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    EN 61249-2-22:2005 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
    EN 61193-2 : 2007 QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES
    EN 123500:1992/A2:1995 SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
    EN 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
    EN 61249-4-18 : 2013 Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    EN 61249-2-23:2005 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
    EN 61249-2-8:2003 Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    EN 60097:1993 Grid systems for printed circuits
    EN 61249-2-41:2010 Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    EN 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
    EN 61249-2-38:2009 Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
    EN 123000:1991/A2:1996 GENERIC SPECIFICATION: PRINTED BOARDS
    EN 61249-2-42 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    EN 123100 : 1992 AMD 1 1995 SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES
    EN 61191-6:2010 Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
    EN 61249-4-1:2008 Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
    EN 123200:1992/A1:1995 SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES
    EN 60068-2-83 : 2011 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011)
    EN 61249-2-35:2009 Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    EN 123700:1996 Sectional Specification: Flex-rigid double sided printed board with through connections
    EN 61249-2-11:2003/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-11: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - POLYIMIDE, BROMINATED EPOXIDE MODIFIED OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    EN 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
    EN 61249-2-30:2013 Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
    EN 62137-4:2014/AC:2015 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)
    EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    EN 61249-2-36:2009 Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    EN 61249-4-12:2005 Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
    EN 61249-2-9:2003 Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    EN 61249-2-40:2013 Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    EN 61249-2-5:2003/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-5: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER REINFORCED CORE / WOVEN E-GLASS REINFORCED SURFACES LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    EN 60068-2-58:2015/A1:2018 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017)
    NF EN 61188-5-1 : 2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
    EN 61249-2-10:2003/corrigendum:2005 Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    EN 61249-4-17:2009 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    EN 123800:1996 Sectional Specification: Flexible multilayer printed boards with through connections
    EN 61249-2-2:2005 Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
    EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    EN 61249-4-11:2005 Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
    EN 61249-2-39 : 2013 Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    EN 61249-4-14 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60050-541:1990 International Electrotechnical Vocabulary (IEV) - Part 541: Printed circuits
    IEC 60050-131:2002 International Electrotechnical Vocabulary (IEV) - Part 131: Circuit theory
    IEC 60050-731:1991 International Electrotechnical Vocabulary (IEV) - Part 731: Optical fibre communication
    IEC 60050-716-1:1995 International Electrotechnical Vocabulary (IEV) - Part 716-1: Integrated services digital network (ISDN) - General aspects
    IEC 60050-471:2007 International Electrotechnical Vocabulary (IEV) - Part 471: Insulators
    IEC 60050-151:2001 International Electrotechnical Vocabulary (IEV) - Part 151: Electrical and magnetic devices
    IEC 60050-212:2010 International Electrotechnical Vocabulary (IEV) - Part 212: Electrical insulating solids, liquids and gases
    IEC 60050-845:1987 International Electrotechnical Vocabulary (IEV) - Part 845: Lighting
    IEC 60050-714:1992 International Electrotechnical Vocabulary (IEV) - Part 714: Switching and signalling in telecommunications
    IEC 60050-726:1982 International Electrotechnical Vocabulary (IEV) - Part 726: Transmission lines and waveguides
    IEC 60050-841:2004 International Electrotechnical Vocabulary (IEV) - Part 841: Industrial electroheat
    IEC 60050-121:1998 International Electrotechnical Vocabulary (IEV) - Part 121: Electromagnetism
    IEC 60050-705:1995 International Electrotechnical Vocabulary (IEV) - Part 705: Radio wave propagation
    IEC 60050-113:2011 International Electrotechnical Vocabulary (IEV) - Part 113: Physics for electrotechnology
    IEC 60050-851:2008 International Electrotechnical Vocabulary (IEV) - Part 851: Electric welding
    IEC 60050-581:2008 International Electrotechnical Vocabulary (IEV) - Part 581: Electromechanical components for electronic equipment
    IEC 60050-723:1997 International Electrotechnical Vocabulary (IEV) - Part 723: Broadcasting: Sound, television, data
    IEC 60050-393:2003 International Electrotechnical Vocabulary (IEV) - Part 393: Nuclear instrumentation - Physical phenomena and basic concepts
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective