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  • IEC 60749-22:2002

    Current The latest, up-to-date edition.

    Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s): 

    Published date:  12-09-2002

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope and object
       1.1 General description of the test
       1.2 Description of the test apparatus (for all methods)
    2 Methods A and B (see also annex A)
       2.1 Scope
       2.2 General description of the test
    3 Method C
       3.1 Scope
       3.2 Method C: Bond peel
    4 Method D
       4.1 Scope
       4.2 Method D: Bond shear (applied to flip chip)
    5 Methods E and F
       5.1 Scope
       5.2 Method E: Push-off test
       5.3 Method F: Pull-off test
       5.4 Failure criteria for both methods E and F
       5.5 Force to be applied (both methods)
    6 Method G: Wire ball shear test
       6.1 Scope
       6.2 General description
       6.3 Terms and definitions
       6.4 Equipment and material
       6.5 Procedure
       6.6 Acceptable test limits
    7 Information to be given in the relevant specification
    Annex A (normative) Guidance

    Abstract - (Show below) - (Hide below)

    Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements.The contents of the corrigendum of August 2003 have been included in this copy.

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    Development Note Supersedes IEC 60749. (03/2008) Stability Date: 2018. (11/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
    I.S. EN 62435-5:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
    13/30264591 DC : 0 BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
    13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
    IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
    BS EN 62435-5:2017 Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices
    PD IEC/TS 62686-1:2015 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
    13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
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