I.S. EN 61188-5-2:2003
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
BS EN 61192-1:2003
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Workmanship requirements for soldered electronic assemblies General |
BS EN 61188-5-1:2002
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Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Attachment (land/joint) considerations. Generic requirements |
07/30169763 DC : 0
|
BS EN 62515 - EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA |
I.S. EN 61192-3:2003
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WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES |
I.S. EN 61193-1:2002
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QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES |
I.S. EN 61192-1:2003
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WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
BS EN 50548 : 2011
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JUNCTION BOXES FOR PHOTOVOLTAIC MODULES |
I.S. EN 50548:2011
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JUNCTION BOXES FOR PHOTOVOLTAIC MODULES |
NF EN 61191-2 : 2014
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PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
I.S. EN 61191-2:2017
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PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
BS EN 61191-3:2017
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Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
IEC 61193-1:2001
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Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
IEC 61191-4:2017
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Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
IEC 61188-5-3:2007
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Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides |
EN 61188-5-1:2002
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Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
EN 61192-3:2003
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Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
EN 61188-5-2:2003
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Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
EN 61188-5-5:2007
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Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
EN 61191-3:2017
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Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
I.S. EN 61188-5-5:2007
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES |
BS EN 61188-5-5:2007
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Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides |
17/30352677 DC : 0
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BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN |
15/30328104 DC : DRAFT JULY 2015
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BS EN 61191-2 - PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
11/30255128 DC : 0
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BS EN 61191-2 - PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
I.S. EN 61188-5-4:2007
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
PD IEC/TS 62647-1:2012
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Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
IEC 61188-5-1:2002
|
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
IEC 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
17/30355792 DC : 0
|
BS EN 62790 AMENDMENT 1 - JUNCTION BOXES FOR PHOTOVOLTAIC MODULES - SAFETY REQUIREMENTS AND TESTS |
I.S. EN 61191-4:2017
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PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
I.S. EN 61191-3:2017
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PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
DIN EN 61191-3:2016-01 (Draft)
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PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
BS CECC 200025:1998
|
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities |
BS EN 61192-4:2003
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Workmanship requirements for soldered electronic assemblies Terminal assemblies |
05/30133283 DC : DRAFT MAY 2005
|
IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
CEI CECC 200025 : 2000
|
PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD ASSEMBLY FACILITIES |
BS EN 61188-5-4:2007
|
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides |
97/206324 DC : DRAFT MAY 1997
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|
I.S. EN 61188-5-3:2007
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES |
BS EN 61188-5-8:2008
|
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA) |
I.S. EN 61191-6:2010
|
PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD |
I.S. EN 61188-5-8:2008
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA) |
BS EN 61191-4:2017
|
Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
GEIA STD 0005-1 : 2012
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PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
IEC TS 62647-1:2012
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
BS EN 61191-6:2010
|
Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods |
UTEC 90 720-1 : 2000
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ELECTRONIC ASSEMBLY TECHNOLOGY - MANUFACTURING LINE CERTIFICATION FOR ELECTRONIC BOARDS (QML) - PART 1: GUIDE FOR DESIGN AND MANUFACTURING OF ELECTRONIC ASSEMBLIES |
BS EN 61190-1-1:2002
|
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
BS EN 61192-3:2003
|
Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies |
CEI EN 61191-4 : 2005
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PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
I.S. EN 61192-2:2003
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WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES |
I.S. EN 61192-4:2003
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES |
I.S. EN 61188-5-1:2002
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS |
IEC 61191-6:2010
|
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method |
IEC PAS 62647-1:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
IEC 61188-5-4:2007
|
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides |
BS EN 61191-2:2017
|
Printed board assemblies Sectional specification. Requirements for surface mount soldered assemblies |
PD IEC/PAS 62647-1:2011
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
IEC 61188-5-8:2007
|
Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) |
IEC 61192-1:2003
|
Workmanship requirements for soldered electronic assemblies - Part 1: General |
IEC 61192-5:2007
|
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
IEC 61192-4:2002
|
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
IEC 61192-2:2003
|
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
IEC 61188-5-5:2007
|
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
IEC 61188-5-2:2003
|
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
IEC 61191-3:2017
|
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
97/230541 DC : DRAFT AUG 1997
|
|
IEC 61192-3:2002
|
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
BS EN 61193-1:2002
|
Quality assessment systems Registration and analysis of defects on printed board assemblies |
CECC 200025 : 1998
|
PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD ASSEMBLY FACILITIES |
BS EN 61192-5:2007
|
Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies |
BS EN 61192-2:2003
|
Workmanship requirements for soldered electronic assemblies Surface-mount assemblies |
15/30329572 DC : 0
|
BS EN 61191-4 - PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
12/30258438 DC : 0
|
BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
15/30330490 DC : 0
|
BS EN 61191-3 - PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
BS EN 61188-5-3:2007
|
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides |
DIN EN 61191-4:2016-01 (Draft)
|
PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
I.S. EN 61192-5:2007
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
I.S. EN 61190-1-1:2002
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
EN 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
BS EN 61188-5-2:2003
|
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components |
IEC 61190-1-1:2002
|
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
EN 50548 : 2011 AMD 2 2014
|
JUNCTION BOXES FOR PHOTOVOLTAIC MODULES |
EN 61193-1:2002
|
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
EN 61188-5-8:2008
|
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) |
EN 61192-5 : 2007
|
WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
EN 61188-5-3:2007
|
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides |
EN 61192-2:2003
|
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
EN 61191-6:2010
|
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method |
EN 61192-1:2003
|
Workmanship requirements for soldered electronic assemblies - Part 1: General |
EN 61192-4:2003
|
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
NF EN 61188-5-1 : 2003
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS |
EN 61191-4:2017
|
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
EN 61188-5-4 : 2007
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
EN 61190-1-1:2002
|
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |