• IEC 62047-6:2009

    Current The latest, up-to-date edition.

    Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  07-04-2009

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Test piece
      4.1 Design of test piece
      4.2 Preparation of test piece
      4.3 Test piece thickness
      4.4 Storage prior to testing
    5 Testing method and test apparatus
      5.1 General
      5.2 Method of gripping (mounting of test piece)
      5.3 Static loading test
      5.4 Method of loading
      5.5 Speed of testing
      5.6 Environment control
    6 Endurances (test termination)
    7 Test report
    Annex A (informative) Technical background of this standard
    Annex B (informative) Test piece
    Annex C (informative) Displacement measurement
    Annex D (informative) Testing environment
    Annex E (informative) Number of test pieces
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 62047-6:2009 specifies the method for axial tensile-tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm under constant force range or constant displacement range. Thin films are used as main structural materials for MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, andtest piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis.

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    Development Note Stability Date: 2018. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
    11/30230316 DC : 0 BS EN 62047-18 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BENDING TEST METHODS OF THIN FILM MATERIALS
    BS EN 62047-18:2013 Semiconductor devices. Micro-electromechanical devices Bend testing methods of thin film materials
    CEI EN 62047-18 : 2014 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS
    I.S. EN 62047-18:2013 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS (IEC 62047-18:2013 (EQV))
    NF EN 62047-18 : 2014 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS
    IEC 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

    Standards Referencing This Book - (Show below) - (Hide below)

    ASTM E 466 : 2015 : REDLINE Standard Practice for Conducting Force Controlled Constant Amplitude Axial Fatigue Tests of Metallic Materials
    ISO 6892:1998 Metallic materials Tensile testing at ambient temperature
    IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
    ISO 1099:2017 Metallic materials — Fatigue testing — Axial force-controlled method
    ISO 12107:2012 Metallic materials — Fatigue testing — Statistical planning and analysis of data
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