• IPC 2152 : 0

    Current The latest, up-to-date edition.

    STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN

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    Published date:  16-09-2009

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
      1.1 Purpose
      1.2 Presentation
      1.3 Interpretation
      1.4 Definition of Terms
    2 APPLICABLE DOCUMENTS
      2.1 IPC
    3 CONDUCTOR SIZING INTRODUCTION
    4 CONDUCTOR SIZING DESIGN GUIDELINES
    5 CONDUCTOR SIZING CHARTS
      5.1 Conductor Sizing Charts for Still Air Environments
      5.2 Conductor Sizing Charts for Vacuum/Space Environments
    APPENDIX A
     A.1 INTRODUCTION
     A.2 DERATING
     A.3 SELECTING A CHART
     A.4 SUPPLEMENTAL MATERIAL
     A.5 ADDITIONAL TOPICS
     A.6 CONDUCTOR SIZING CHARTS
     A.7 REFERENCES

    Abstract - (Show below) - (Hide below)

    Provides guidance on how thermal conductivity, vias, copper planes, power dissipation and printed board material and thickness all factor into the relationship between current, conductor size, and temperature.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in IPC C 106 and IPC C 1000. (09/2009) Included in IPC C 105. (03/2010) Also available in German Language, See IPC 2152 GERMAN. (05/2010)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 2222 GERMAN : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC 2222 FRENCH : A2010 SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC 2223 CHINESE : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
    IPC 2222 CHINESE : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    IPC 2223 GERMAN : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
    I.S. EN 60079-11:2012 EXPLOSIVE ATMOSPHERES - PART 11: EQUIPMENT PROTECTION BY INTRINSIC SAFETY 'I'
    IPC 2222 : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
    BIS IS/IEC 60079-11 : 2006 EXPLOSIVE ATMOSPHERES - PART 11: EQUIPMENT PROTECTION BY INTRINSIC SAFETY 'I'
    IEC 60079-11:2011 RLV Explosive atmospheres - Part 11: Equipment protection by intrinsic safety "i"
    IEC 60079-11 REDLINE : 6.0 EXPLOSIVE ATMOSPHERES - PART 11: EQUIPMENT PROTECTION BY INTRINSIC SAFETY 'I'
    UNE-EN 60079-11:2013 Explosive atmospheres - Part 11: Equipment protection by intrinsic safety "i"
    IEC 60079-11:2011 Explosive atmospheres - Part 11: Equipment protection by intrinsic safety "i"
    BS EN 60079-11:2012 Explosive atmospheres Equipment protection by intrinsic safety \'i\'
    08/30175787 DC : DRAFT JAN 2008 BS EN 60079-11 - EXPLOSIVE ATMOSPHERES - PART 11: EQUIPMENT PROTECTION BY INTRINSIC SAFETY "I"
    BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
    EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards
    MIL-HDBK-1861 Revision B:2013 Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware
    CSA C22.2 No. 60079-11 : 2014 EXPLOSIVE ATMOSPHERES - PART 11: EQUIPMENT PROTECTION BY INTRINSIC SAFETY 'I'
    EN 60079-11:2012 Explosive atmospheres - Part 11: Equipment protection by intrinsic safety "i"

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
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