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  • IPC 9707 : 0

    Current The latest, up-to-date edition.

    SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS

    Available format(s):  Hardcopy

    Language(s):  English

    Published date:  01-05-2018

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 TERMS AND DEFINITIONS
    4 SAMPLE SIZE
    5 APPARATUS AND SETUP
    6 TEST VEHICLES
    7 TEST PROCEDURE
    8 FAILURE CRITERIA AND ANALYSIS
    ANNEX A (INFORMATIVE) - FAILURE ANALYSIS TECHNIQUES

    Abstract - (Show below) - (Hide below)

    Qualifies the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in IPC C 103 & IPC C 1000. Jointly published by IPC and JEDEC. (09/2011)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 9704 CHINESE : - PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE
    IPC 9709 : 0 TEST GUIDELINES FOR ACOUSTIC EMISSION MEASUREMENT DURING MECHANICAL TESTING
    IPC 9704 : A PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC 9704 : A PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE
    IPC 9703 : 0 IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY
    IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
    IPC 9702 : 0 MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS
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