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  • ISO/IEC 14575:2000

    Current The latest, up-to-date edition.

    Information technology Microprocessor systems Heterogeneous InterConnect (HIC) (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English

    Published date:  20-07-2000

    Publisher:  International Organization for Standardization

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    Abstract - (Show below) - (Hide below)

    This International Standard applies to physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10 Mbit/s to 200 Mbit/s and at 1 Gbit/s in copper and optic technologies (as developed in Open Microprocessor Systems Initiative/Heterogeneous InterConnect Project (OMI/HIC)).

    The object of this International Standard is to enable high-performance, scalable, modular, parallel systems to be constructed with low system integration cost; to support communications systems fabric; to provide a transparent implementation of a range of high-level protocols (communications, e.g. ATM, message passing, shared memory transactions, etc.), and to support links between heterogeneous systems.

    General Product Information - (Show below) - (Hide below)

    Development Note Also numbered as IEEE 1355 (07/2001)
    Document Type Standard
    Publisher International Organization for Standardization
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60825-2:2004+AMD1:2006+AMD2:2010 CSV Safety of laser products - Part 2: Safety of optical fibre communication systems (OFCS)
    IEC 60512-8:1993 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 8: Connector tests (mechanical) and mechanical tests on contacts and terminations
    IEC 60512-6:1984 Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6: Climatic tests and soldering tests
    IEC 61000-4-4 : 3.0EN+(REDLINE+VERSION) ELECTROMAGNETIC COMPATIBILITY (EMC) - PART 4-4: TESTING AND MEASUREMENT TECHNIQUES - ELECTRICAL FAST TRANSIENT/BURST IMMUNITY TEST
    IEC 60793-2:2015 Optical fibres - Part 2: Product specifications - General
    IEC 61196-2:1995 Radio-frequency cables - Part 2: Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethylene (PTFE) insulation
    IEC 60793-1:1992 Optical fibres - Part 1: Generic specification
    IEC 60512-7:1993 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests
    IEC 60825-1:2014 Safety of laser products - Part 1: Equipment classification and requirements
    IEC 61000-4-4:2012 RLV Electromagnetic compatibility (EMC) - Part 4-4: Testing and measurement techniques - Electrical fast transient/burst immunity test
    CISPR 22:2008 Information technology equipment - Radio disturbance characteristics - Limits and methods of measurement
    IEC 60874-1:2011 Fibre optic interconnecting devices and passive components - Connectors for optical fibres and cables - Part 1: Generic specification
    IEC 60352-5:2012 Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance
    IEC 61076-4:1995 Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 4: Sectional specification - Printed board connectors
    IEC 61156-1:2007+AMD1:2009 CSV Multicore and symmetrical pair/quad cables for digital communications - Part 1: Generic specification
    IEC 60512-4:1976 Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 4: Dynamic stress tests
    IEC 61076-4-101:2001 Connectors for electronic equipment - Part 4-101: Printed board connectors with assessed quality - Detail specification for two-part connector modules, having a basic grid of 2,0 mm for printed boards and backplanes in accordance with IEC 60917
    IEC 60512-9:1992 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 9: Miscellaneous tests
    IEC 61196-1:2005 Coaxial communication cables - Part 1: Generic specification - General, definitions and requirements
    IEC 61754-6:2013 Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 6: Type MU connector family
    IEC 60512-5:1992 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests
    IEC 60512-3:1976 Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 3: Current-carrying capacity tests
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