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  • IPC J STD 002 : D

    View superseded by
    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES

    Available format(s):  Hardcopy

    Superseded date:  23-08-2019

    Language(s):  English

    Published date:  24-06-2013

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 PREFACE
    2 APPLICABLE DOCUMENTS
    3 REQUIREMENTS
    4 TEST PROCEDURES
    5 NOTES
    APPENDIX A - Critical Component Surfaces
    APPENDIX B - Evaluation Aids
    APPENDIX C - Calculation of Maximum
                 Theoretical Force
    APPENDIX D - Calculation of Integrated Value
                 of Area of the Wetting Curve
    APPENDIX E - Informative Annex
    APPENDIX F - J-STD-002/J-STD-003 Activated
                 Solderability Test Flux Rationale
                 Committee Letter
    APPENDIX G - Graphical Representations:
                 Progression of Solder Wetting
                 Curve Parameters As Measured
                 By Wetting Balance Testing
    APPENDIX H - Test Protocol for Wetting

    Abstract - (Show below) - (Hide below)

    Describes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs.

    General Product Information - (Show below) - (Hide below)

    Committee 5-20
    Development Note Supersedes IPC S 805, EIA IS 49 & EIA 638. Included in IPC C 103 & IPC C 1000. Supersedes EIA 364-52. (07/2009) Also available in Chinese Language, See separate record J STD 002 CHINESE. (05/2016) Jointly Published by IPC, EIA and JEDEC. (07/2013) Supersedes EIA JESD 22-B102. (03/2016) Also available in Hardcopy format. (03/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    DSCC 06012 : A RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (2.0 WATT), STYLE 2816
    DSCC 04006 : A CAPACITORS, TANTALUM, HYBRID, HERMETICALLY SEALED
    MIL-PRF-32535 Revision A:2017 Capacitor, Chip, Fixed, Ceramic Dielectric (Temperature Stable and General Purpose), Extended Range, High Reliability and Standard Reliability, General Specification for
    ASTM B 965 : 2009 Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability
    DSCC 06011 : C RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (1.0 WATT), STYLE 2512
    IEC 60810:2017 Lamps, light sources and LED packages for road vehicles - Performance requirements
    I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    PD IEC/TS 62861:2017 Guidelines for principal component reliability testing for LED light sources and LED luminaires
    BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
    14/30309696 DC : 0 BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    EN 60810 : 2018 LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
    EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    MIL-DTL-83731 Revision E:2016 SWITCHES, TOGGLE, UNSEALED AND SEALED, GENERAL SPECIFICATION FOR
    IPC TR 461 : 1979 SOLDERABILITY EVALUATION OF THICK AND THIN FUSED COATINGS
    IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK
    IPC J STD 001 SWEDISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC A 610 DANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    MIL-STD-202-208 Base Document:2015 METHOD 208, SOLDERABILITY
    IPC J STD 003 CHINESE : B SOLDERABILITY TESTS FOR PRINTED BOARDS
    IPC J STD 001 RUSSIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC A 610 SPANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC SPVC-LAT1 : 2010 ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA
    IPC WHMA A 620 HUNGARIAN : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC J STD 001 TURKISH : E2010 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 POLISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC A 610 ROMANIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC WHMA A 620 TURKISH : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC TA 722 : 1990 TECHNOLOGY ASSESSMENT HANDBOOK ON SOLDERING
    IPC WHMA A 620 HEBREW : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC A 610 CZECH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 7093 CHINESE : - DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC A 610 GERMAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 HINDI : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 9592 : B REQUIREMENTS FOR POWER CONVERSION DEVICES FOR THE COMPUTER AND TELECOMMUNICATIONS INDUSTRIES
    IPC TR 465 1 : 1993 ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY
    IPC A 610 ESTONIAN : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 POLISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC WHMA A 620 SPANISH : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC WHMA A 620 CHINESE : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC TR 462 : 0 SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE
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    IPC WHMA A 620 VIETNAMESE : B2012 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC A 610 KOREAN : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
    IPC SPVC2005-CD : 2005 ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER
    IPC CH 65 CHINESE : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
    IPC A 610 ITALIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC TR 466 : 1995 TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST
    IPC A 610 FRENCH : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    MIL STD 750-2 : A MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES - PART 2: TEST METHODS 2001 THROUGH 2999
    MIL-PRF-8805 Revision G:2016 SWITCHES AND SWITCH ASSEMBLIES, SENSITIVE, SNAP ACTION (BASIC, LIMIT, PUSH BUTTON AND TOGGLE SWITCHES), GENERAL SPECIFICATION FOR
    IPC J STD 001 HUNGARIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
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    IPC HDBK 005 : 0 GUIDE TO SOLDER PASTE ASSESSMENT
    IPC J STD 075 GERMAN : 0 CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
    IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    MIL-PRF-83446-36 Revision B:2012 COILS, RADIO FREQUENCY, CHIP, OPEN CONSTRUCTION, SURFACE MOUNT, 0603 SIZE
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    IPC WHMA A 620 POLISH : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    MIL-DTL-3950 Revision K:2016 Switches, Toggle, Environmentally Sealed, General Specification for
    IPC 7351 GERMAN : B Basic requirements for SMT design and SMD patch guideline
    IPC A 610 CHINESE : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 TURKISH : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    MIL STD 11991 : A GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES
    IPC A 610 JAPANESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 075 CHINESE : - CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
    IPC J STD 001 DANISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC A 610 RUSSIAN : D ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC TR 465 3 : - EVALUATION OF STEAM AGING ON ALTERNATIVE FINISHES, PHASE 2A
    IPC A 610 VIETNAMESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC WHMA A 620 KOREAN : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    MIL-PRF-83446-37 Revision A:2011 COILS, RADIO FREQUENCY, CHIP, OPEN CONSTRUCTION, SURFACE MOUNT, 0805 SIZE
    MIL-PRF-39010-15 Base Document:2013 COILS, RADIO FREQUENCY, OPEN CONSTRUCTION, CERAMIC CORE, FIXED, SURFACE MOUNT ESTABLISHED RELIABILITY & NON-ESTABLISHED RELIABILITY
    DSCC 06009 : A RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.25 WATT), STYLE 1206
    DSCC 06010 : B RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.5 WATT), STYLE 2010
    DSCC 15010 : A CAPACITOR, TANTALUM, HYBRID, HERMETICALLY SEALED
    BS EN 60810:2015 Lamps for road vehicles. Performance requirements
    DSCC 06007 : A RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.1 WATT), STYLE 0603
    VDE 0468-2-69 : 2018 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
    ASTM B 965 : 2009 : R2014 Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability
    PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
    IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC WHMA A 620 DANISH : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    DSCC 04003 : E CAPACITOR, TANTALUM, HYBRID, HERMETICALLY SEALED
    DSCC 06008 : A RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.125 WATT), STYLE 0805
    EN 60068-2-69:2017/AC:2018-03 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018)
    I.S. EN 60810:2015 LAMPS FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
    MIL-PRF-32560-2 Base Document:2016 COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, SHIELDED ESTABLISHED RELIABILITY, SURFACE MOUNT
    MIL-PRF-32560-1 Base Document:2016 COIL, RADIO FREQUENCY, CHIP, FIXED, CONFORMAL COATED, ESTABLISHED RELIABILITY, SURFACE MOUNT
    MIL-PRF-32560-6 Base Document:2016 COIL, RADIO FREQUENCY, CHIP, FIXED, OPEN CONSTRUCTION ESTABLISHED RELIABILITY, SURFACE MOUNT, 0603 SIZE
    DIN EN 60068-2-69 : 2007 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    BS EN 61191-4:2017 Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
    GEIA STD 0006 : 2008 REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    IPC J STD 075 : 0 CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    I.S. EN IEC 60810:2018 LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
    MIL-PRF-39010-16 Base Document:2013 COILS, RADIO FREQUENCY, OPEN CONSTRUCTION, FERRITE CORE, FIXED, SURFACE MOUNT ESTABLISHED RELIABILITY & NON-ESTABLISHED RELIABILITY
    SAE J 2685 : 2014 POSITIVE TEMPERATURE COEFFICIENT OVERCURRENT PROTECTION DEVICES (PTCS)
    IEC PAS 62686-2:2016 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components
    I.S. EN 60068-2-69:2017 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
    EN IEC 60810:2018 Lamps, light sources and led packages for road vehicles - Performance requirements
    BS EN IEC 60810:2018 Lamps, light sources and led packages for road vehicles. Performance requirements
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    IEC TS 62668-2:2016 Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    16/30350012 DC : 0 BS EN 60810 - LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS
    PD IEC/PAS 62686-2:2016 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for passive components
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
    15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    PD IEC/PAS 62647-1:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
    IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
    11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    BS EN 62435-5:2017 Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices
    PD IEC/TS 62668-2:2016 Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    MIL-PRF-83421 Revision F:2017 CAPACITOR, FIXED, METALLIZED PLASTIC FILM DIELECTRIC, (DC, AC, OR DC AND AC), HERMETICALLY SEALED IN METAL CASES OR CERAMIC CASES, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
    MIL-PRF-10304 Revision F:1999 METERS, ELECTRICAL INDICATING, PANEL TYPE, RUGGEDIZED, GENERAL SPECIFICATION FOR
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    SAE AS 22759 : 2014 WIRE, ELECTRICAL, FLUOROPOLYMER-INSULATED, COPPER OR COPPER ALLOY
    SAE AS 29606 : 2014 WIRE, ELECTRICAL, STRANDED, UNINSULATED COPPER, COPPER ALLOY, OR ALUMINUM, OR THERMOCOUPLE EXTENSION, GENERAL SPECIFICATION FOR
    EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
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