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  • IPC J STD 030 : A

    Current The latest, up-to-date edition.

    SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS

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    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 TERMS AND DEFINITIONS
    4 BACKGROUND
    5 MECHANICAL CONSIDERATIONS
    6 UNCURED UNDERFILL CHARACTERISTICS
    7 MATERIALS PACKAGING, HANDLING, AND STORAGE
    8 APPLICATION PROCESS
    9 CURE PROCESS
    10 CURED UNDERFILL CHARACTERISTICS
    11 WORKMANSHIP
    12 PROCESS RELIABILITY ASSESSMENT
    13 OTHER CONSIDERATIONS
    14 TROUBLE SHOOTING

    Abstract - (Show below) - (Hide below)

    Gives users of underfill material with guidance in selecting and evaluating underfill material for assembly solder joints second level interconnects.

    General Product Information - (Show below) - (Hide below)

    Committee 5-20
    Development Note Included in IPC C 103 & IPC C 1000. (08/2008) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    ASTM D 2471 : 1999 Standard Test Method for Gel Time and Peak Exothermic Temperature of Reacting Thermosetting Resins (Withdrawn 2008)
    ASTM D 792 : 2013 : REDLINE Standard Test Methods for Density and Specific Gravity (Relative Density) of Plastics by Displacement
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC 7711/21 : B REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
    IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
    ASTM D 257 : 2014 : REDLINE Standard Test Methods for DC Resistance or Conductance of Insulating Materials
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