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  • MIL-DTL-19491 Revision J:2014

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES, PACKAGING OF

    Available format(s):  PDF

    Language(s):  English

    Published date: 

    Publisher:  US Military Specs/Standards/Handbooks

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    Table of Contents - (Show below) - (Hide below)

    1. SCOPE
    2. APPLICABLE DOCUMENTS
    3. REQUIREMENTS
    4. VERIFICATION
    5. PACKAGING
    6. NOTES

    Abstract - (Show below) - (Hide below)

    Specifies the requirements for the preservation, packing, and container marking of semiconductor devices such as transistors and diodes.

    General Product Information - (Show below) - (Hide below)

    Committee AREA PACK
    Development Note Supersedes MIL S 19491 (G) (03/2004)
    Document Type Standard
    Publisher US Military Specs/Standards/Handbooks
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    DSCC 85136 : E HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, FIN STOCK, ALUMINIUM ALLOY
    DSCC 88013 : G DELAY LINES, PASSIVE, 3-PIN, SIP
    DSCC 85013 : E DELAY LINES, 5 TAPS, 14 PIN DIP COMPATIBLE, TTL INTERFACED
    MIL-STD-2073-1 Revision E:2008 STANDARD PRACTICE FOR MILITARY PACKAGING
    DSCC 85141 : C DELAY LINE, THREE DELAY LINE UNITS, 14 PIN DIP COMPATIBLE, TTL INTERFACED
    DSCC 87035 : C DELAY LINE, ACTIVE, TRIPLE, 14-PIN DIP COMPATIBLE, LOW POWER SCHOTTKY
    DSCC 88023 : D DELAY LINES, ACTIVE, PROGRAMMABLE 4 BIT, 24-PIN, SURFACE MOUNT, ECL INTERFACED
    DSCC 84035 : D DELAY LINES, PASSIVE, 10-TAP, DUAL-IN-LINE, 16-PIN
    DSCC 84087 : J#INA DELAY LINES, 1 TO 5 TAPS, 14-PIN DIP COMPATIBLE, T[2]L INTERFACED

    Standards Referencing This Book - (Show below) - (Hide below)

    MIL-PRF-81705 Revision E:2009 Barrier Materials, Flexible, Electrostatic Discharge Protective, Heat-Sealable
    MIL-STD-129 Revision R:2014 Military Marking for Shipment and Storage
    ANSI/NCSL Z540 3 : 2006(R2013) REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT
    MIL-STD-2073-1 Revision E:2008 STANDARD PRACTICE FOR MILITARY PACKAGING
    MIL-PRF-19500 Revision P:2010 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
    MIL-STD-1686 Revision C:1995 ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)
    MIL-STD-750 Revision F:2011 TEST METHODS FOR SEMICONDUCTOR DEVICES
    MIL-DTL-117 Revision H:2001 BAGS, HEAT-SEALABLE
    FED-STD-123 Revision H:2007 MARKING FOR SHIPMENT (CIVIL AGENCIES)
    MIL-HDBK-263 Revision B:1994 ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL & ELECTRONIC PARTS, ASSEMBLIES & EQUIPMENT
    ISO 10012:2003 Measurement management systems — Requirements for measurement processes and measuring equipment
    A-A-59135 Base Document:1997 PACKAGING MATERIAL, SHEET
    A-A-59136 Base Document:1997 CUSHIONING MATERIAL, PACKAGING, CLOSED CELL FOAM PLANK
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