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  • MIL STD 750-2 : A

    Current The latest, up-to-date edition.

    MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES - PART 2: TEST METHODS 2001 THROUGH 2999

    Available format(s):  PDF

    Language(s):  English

    Published date: 

    Publisher:  US Military Specs/Standards/Handbooks

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    SUMMARY OF REVISION A, CHANGE 2 MODIFICATIONS
    1. SCOPE
    2. APPLICABLE DOCUMENTS
    3. DEFINITIONS
    4. GENERAL REQUIREMENTS
    5. DETAILED REQUIREMENTS
    6. NOTES
    CONCLUDING MATERIAL

    Abstract - (Show below) - (Hide below)

    Determines uniform test methods for the mechanical testing to determine resistance to deleterious effects of natural elements and conditions surrounding military operations.

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    Committee FSC 5961
    Document Type Standard
    Publisher US Military Specs/Standards/Handbooks
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    MIL-STD-750 Revision F:2011 TEST METHODS FOR SEMICONDUCTOR DEVICES
    MIL-STD-750-1 Revision A:2015 Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999

    Standards Referencing This Book - (Show below) - (Hide below)

    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    ISO 14644-2:2015 Cleanrooms and associated controlled environments Part 2: Monitoring to provide evidence of cleanroom performance related to air cleanliness by particle concentration
    ANSI/NCSL Z540 3 : 2006(R2013) REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT
    MIL-PRF-19500 Revision P:2010 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
    MIL-STD-750-1 Revision A:2015 Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999
    MIL-STD-750 Revision F:2011 TEST METHODS FOR SEMICONDUCTOR DEVICES
    IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    IPC J STD 005 : A REQUIREMENTS FOR SOLDERING PASTES
    IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
    ISO 14644-1:2015 Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration
    IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
    MIL-STD-750-3 Base Document:2012 Transistor Electrical Test Methods for Semiconductor Devices Part 3: Test Methods 3000 Through 3999
    FED-STD-595 Revision C:2008 COLORS USED IN GOVERNMENT PROCUREMENT
    ASTM D 1867 : 2013 : REDLINE Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
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