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    IEC 60939-2-1 : 1.0

    COMPLETE FILTER UNITS FOR RADIO INTERFERENCE SUPPRESSION - PART 2-1: BLANK DETAIL SPECIFICATION - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - FILTERS FOR WHICH SAFETY TESTS ARE REQUIRED (ASSESSMENT LEVEL D/DZ)

    International Electrotechnical Committee

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    IEC 62137 : 1.0 : COR 1

    ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FGBA, BGA, FLGA, LGA, SON AND QFN

    International Electrotechnical Committee

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    IEC 60068-2-21 : 6.0

    ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES

    International Electrotechnical Committee

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    IEC 61192-5 : 1.0

    WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES

    International Electrotechnical Committee

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    IEC 60068-2-82 : 1.0

    ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST XW[1]: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS

    International Electrotechnical Committee

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    IEC 62137-1-1 : 1.0

    SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST

    International Electrotechnical Committee

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    IEC 62137-1-2 : 1.0

    SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST

    International Electrotechnical Committee

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    IEC 62421 : 1.0

    ELECTRONICS ASSEMBLY TECHNOLOGY - ELECTRONIC MODULES

    International Electrotechnical Committee

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    IEC 61193-2 : 1.0

    QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES

    International Electrotechnical Committee

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    IEC PAS 62588 : 1.0

    MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD(PB), PB-FREE AND OTHER ATTRIBUTES

    International Electrotechnical Committee

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