COMPLETE FILTER UNITS FOR RADIO INTERFERENCE SUPPRESSION - PART 2-1: BLANK DETAIL SPECIFICATION - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - FILTERS FOR WHICH SAFETY TESTS ARE REQUIRED (ASSESSMENT LEVEL D/DZ)

International Electrotechnical Committee

ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FGBA, BGA, FLGA, LGA, SON AND QFN

International Electrotechnical Committee

ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES

International Electrotechnical Committee

WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES

International Electrotechnical Committee

ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST XW[1]: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS

International Electrotechnical Committee

SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST

International Electrotechnical Committee

SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST

International Electrotechnical Committee

ELECTRONICS ASSEMBLY TECHNOLOGY - ELECTRONIC MODULES

International Electrotechnical Committee

QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES

International Electrotechnical Committee

MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD(PB), PB-FREE AND OTHER ATTRIBUTES

International Electrotechnical Committee