DEVICE EMBEDDED SUBSTRATE - GUIDELINES - DATA FORMAT

International Electrotechnical Committee

DEVICE EMBEDDED SUBSTRATE - PART 2-2: GUIDELINES - ELECTRICAL TESTING

International Electrotechnical Committee

TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING

International Electrotechnical Committee

TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS

International Electrotechnical Committee

ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD

International Electrotechnical Committee

PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES

International Electrotechnical Committee

PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES

International Electrotechnical Committee

ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)

International Electrotechnical Committee

PRINTED BOARDS DESIGN, MANUFACTURE AND ASSEMBLY - VOCABULARY - PART 2: COMMON USAGE IN ELECTRONIC TECHNOLOGIES AS WELL AS PRINTED BOARD AND ELECTRONIC ASSEMBLY TECHNOLOGIES

International Electrotechnical Committee

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

International Electrotechnical Committee