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    IEC TR 61191-7:2020

    Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

    International Electrotechnical Committee

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    IEC TR 61188-8:2021

    Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library

    International Electrotechnical Committee

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    IEC 61760-3:2021

    Surface mounting technology – Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

    International Electrotechnical Committee

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    IEC 61188-6-2:2021

    Circuit boards and circuit board assemblies – Design and use – Part 6-2: Land pattern design – Description of land pattern for the most common surface mounted components (SMD)

    International Electrotechnical Committee

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    IEC 60194-1:2021

    Printed boards design, manufacture and assembly – Vocabulary – Part 1: Common usage in printed board and electronic assembly technologies

    International Electrotechnical Committee

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    IEC 61188-6-1:2021

    Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design – Generic requirements for land pattern on circuit boards

    International Electrotechnical Committee

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