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    IPC SM 840 : E

    QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS

    Institute of Printed Circuits

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    IPC SM 784 : 0

    GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION

    Institute of Printed Circuits

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    IPC 3406 : 0

    GUIDELINES FOR ELECTRICALLY CONDUCTIVE SURFACE MOUNT ADHESIVES

    Institute of Printed Circuits

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    IPC D 326 : A

    INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES

    Institute of Printed Circuits

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    IPC CA 821 : 0

    GENERAL REQUIREMENTS FOR THERMALLY CONDUCTIVE ADHESIVES

    Institute of Printed Circuits

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    IPC A 311 : 0

    PROCESS CONTROLS FOR PHOTOTOOL GENERATION AND USE

    Institute of Printed Circuits

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    IPC MS 810 : 0

    GUIDELINES FOR HIGH VOLUME MICROSECTION

    Institute of Printed Circuits

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    IPC QF 143 : 0

    SPECIFICATION FOR FINISHED FABRIC WOVEN FROM QUARTZ (PURE FUSED SILICA) FOR PRINTED BOARDS

    Institute of Printed Circuits

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    IPC SG 141 : 0

    SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'S' GLASS FOR PRINTED BOARDS

    Institute of Printed Circuits

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    IPC DR 570 : A

    GENERAL SPECIFICATION FOR 1/8 INCH DIAMETER SHANK CARBIDE DRILLS FOR PRINTED BOARDS

    Institute of Printed Circuits

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