Comment Closes On
|
|
Committee
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EPL/501 |
Document Type
|
Draft |
ISBN
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|
Pages
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|
Published
|
|
Publisher
|
British Standards Institution
|
Status
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Superseded |
Superseded By
|
|
IEC 61188-5-2:2003
|
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
IEC 60068-1:2013
|
Environmental testing - Part 1: General and guidance |
IEC 61190-1-2:2014
|
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
IEC 60249-2-4:1987
|
Base materials for printed circuits. Part 2: Specifications. Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade |
IEC 60194:2015
|
Printed board design, manufacture and assembly - Terms and definitions |
IEC 60068-2-14:2009
|
Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
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