1 Scope
2 Normative references
3 Terms and definitions
4 Procedure of selecting the applicable test method
4.1 Stress to solder joints in the field and test
methods
4.2 Selection of test methods based on the shapes
and terminals of electronic devices
4.2.1 Surface mount devices
4.2.2 Insertion component (leaded device)
5 Common subjects in each test method
5.1 Mounting device and materials used
5.2 Soldering condition
5.2.1 Other specifications
5.3 Accelerated stress test
5.3.1 Rapid temperature change test (apply to all
solder alloy in this document)
5.3.2 High temperature test (apply to
Bi58Sn42 alloy solder only)
5.3.3 High temperature and High humidity test
(constant) (apply
to Sn91Zn9 and Sn89Zn8Bi3 alloy solder)
6 Evaluation test method
6.1 Solder joint strength test of SMD before and
after the rapid temperature change test
6.1.1 Pull strength test
6.1.2 Shear strength test for force applied to the
side of a specimen
6.1.3 Torque shear strength test
6.1.4 Monotonic bending strength test
6.2 Cyclic bending strength test
6.3 Mechanical shear fatigue test
6.4 Cyclic drop test
6.4.1 Cyclic drop test
6.4.2 Cyclic steel ball drop strength test
6.5 Strength test of leaded device
6.5.1 Pull strength test of leaded device
6.5.2 Creep strength test of leaded device
Annex A (Informative) - Condition of rapid temperature change
test
Annex B (Informative) - Solder joint test by electrical
conduction
Annex C (Informative) - Torque shear strength test
Annex D (Informative) - Monotonic bending strength test
Annex E (Informative) - Cyclic steel ball drop strength test
Annex F (Informative) - Pull strength test
Annex G (Informative) - Creep strength test
Annex H (Informative) - Fillet lifting phenomenon observation
of leaded device solder joint and the life test by
electrical conduction