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    Current The latest, up-to-date edition.

    BS EN 60191-6-5 - GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE - DESIGN GUIDE FOR FINE-PITCH BALL GRID (FBGA)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date: 

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Terminal position numbering
    5 Nominal package dimension
    6 Outline drawings and principle dimensions
    7 Dimensions

    General Product Information - (Show below) - (Hide below)

    Comment Closes On
    Committee EPL/47
    Document Type Draft
    Publisher British Standards Institution
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
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