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AEC Q200 : REV D
|
STRESS TEST QUALIFICATION FOR PASSIVE COMPONENTS |
|
SAE ARP 6379 : 2016
|
PROCESSES FOR APPLICATION-SPECIFIC QUALIFICATION OF ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS AND SUB-ASSEMBLIES FOR USE IN AEROSPACE, DEFENSE, AND HIGH PERFORMANCE SYSTEMS |
|
SAE AS 5553B : 2016
|
COUNTERFEIT ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION |
|
GEIA HB 0005-2 : 2007
|
TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
|
AIAG IATF 16949 : 2016
|
QUALITY MANAGEMENT SYSTEM REQUIREMENTS FOR AUTOMOTIVE PRODUCTION AND RELEVANT SERVICE PART ORGANIZATIONS |
|
GEIA STD 0005-3 : 2013
|
PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES |
|
SAE AS 6171 : 2016
|
TEST METHODS STANDARD; GENERAL REQUIREMENTS, SUSPECT/COUNTERFEIT, ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS |
|
MIL STD 883 : K
|
TEST METHOD STANDARD - MICROCIRCUITS |
|
AEC Q100 : REV H
|
FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR INTEGRATED CIRCUITS |
|
UL 94 : 6
|
TESTS FOR FLAMMABILITY OF PLASTIC MATERIALS FOR PARTS IN DEVICES AND APPLIANCES |
|
IEC 61967-1 : 1.0
|
INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 1: GENERAL CONDITIONS AND DEFINITIONS |
|
SAE AS 6081 : 2012
|
FRAUDULENT/COUNTERFEIT ELECTRONIC PARTS: AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION - DISTRIBUTORS |
|
IEC 61340-5-1 : 2.0
|
ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS |
|
MIL PRF 19500 : P
|
SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
|
AEC Q003 : REV A
|
GUIDELINE FOR CHARACTERIZATION OF INTEGRATED CIRCUITS |
|
IEC TR 61340-5-2 : 1.0
|
ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
|
IEC TS 62668-1 : 3.0
|
PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 1: AVOIDING THE USE OF COUNTERFEIT, FRAUDULENT AND RECYCLED ELECTRONIC COMPONENTS |
|
RTCA DO 254 : 2000
|
DESIGN ASSURANCE GUIDANCE FOR AIRBORNE ELECTRONIC HARDWARE |
|
SAE J 1752/3 : 2011
|
MEASUREMENT OF RADIATED EMISSIONS FROM INTEGRATED CIRCUITS - TEM/WIDEBAND TEM (GTEM) CELL METHOD; TEM CELL (150 KHZ TO 1 GHZ), WIDEBAND TEM CELL (150 KHZ TO 8 GHZ) |
|
IEC TR 62240-1 : 1ED 2013
|
PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS CAPABILITY IN OPERATION - PART 1: TEMPERATURE UPRATING |
|
GEIA HB 0005-3 : 2008
|
REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
|
ESDA/JEDEC JS-001 : 2017
|
ELECTROSTATIC DISCHARGE SENSITIVITY TESTING - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL |
|
IEC TS 62647-3 : 1ED 2014
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
|
AEC Q101 : REV D1
|
FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR DISCRETE SEMICONDUCTORS IN AUTOMOTIVE APPLICATIONS |
|
IEC 62396-4:2013
|
PROCESS MANAGEMENT FOR AVIONICS - ATMOSPHERIC RADIATION EFFECTS - PART 4: DESIGN OF HIGH VOLTAGE AIRCRAFT ELECTRONICS MANAGING POTENTIAL SINGLE EVENT EFFECTS |
|
GEIA HB 0005-1 : 2006
|
PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
|
IEC TR 62396-7 : 2017
|
PROCESS MANAGEMENT FOR AVIONICS - ATMOSPHERIC RADIATION EFFECTS - PART 7: MANAGEMENT OF SINGLE EVENT EFFECTS (SEE) ANALYSIS PROCESS IN AVIONICS DESIGN |
|
ISO 9004 : 2009
|
QUALITY MANAGEMENT - QUALITY OF AN ORGANIZATION - GUIDANCE TO ACHIEVE SUSTAINED SUCCESS |
|
MIL HDBK 263 : B
|
ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL & ELECTRONIC PARTS, ASSEMBLIES & EQUIPMENT |
|
IEC TS 62564-1 : 3.0
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
|
IEC Q 03-4 : 3.0
|
IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PRODECURE - PART 4: IECQ AVIONICS SCHEME - AVIONICS PARTS AND ASSEMBLY MANAGEMENT |
|
GEIA STD 0016 : 2012
|
PREPARING A DMSMS MANAGEMENT PLAN |
|
IEC 62396-5 : 2014
|
PROCESS MANAGEMENT FOR AVIONICS - ATMOSPHERIC RADIATION EFFECTS - PART 5: ASSESSMENT OF THERMAL NEUTRON FLUXES AND SINGLE EVENT EFFECTS IN AVIONICS SYSTEMS |
|
IEC 62396-3 : 1ED 2013
|
PROCESS MANAGEMENT FOR AVIONICS - ATMOSPHERIC RADIATION EFFECTS - PART 3: SYSTEM DESIGN OPTIMIZATION TO ACCOMMODATE THE SINGLE EVENT EFFECTS (SEE) OF ATMOSPHERIC RADIATION |
|
ISO 9001:2015
|
QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS |
|
EIA STD 4899 : 2017-05
|
REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
|
ISO 9000 : 2015
|
QUALITY MANAGEMENT SYSTEMS - FUNDAMENTALS AND VOCABULARY |
|
AEC Q004 : DRAFT 2006
|
ZERO DEFECTS GUIDELINE |
|
MIL PRF 38535 : K
|
INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR |
|
SAE AS 6496 : 2014
|
FRAUDULENT/COUNTERFEIT ELECTRONIC PARTS: AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION - AUTHORIZED/FRANCHISED DISTRIBUTION |
|
AIAA R 100 : A 2001
|
RECOMMENDED PRACTICE FOR PARTS MANAGEMENT |
|
MIL STD 3018 : 0
|
PARTS MANAGEMENT |
|
GEIA STD 0008 : 2011
|
DERATING OF ELECTRONIC COMPONENTS |
|
GEIA STD 0002-1 : 2005
|
AEROSPACE QUALIFIED ELECTRONIC COMPONENT (AQEC) REQUIREMENTS, VOLUME 1 - INTEGRATED CIRCUITS AND SEMICONDUCTORS |
|
IEC 60695-11-5 : 2.0
|
FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE |
|
J STD 020 : D-1
|
MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
|
AEC Q100-010 : REV A
|
SOLDER BALL SHEAR TEST |
|
IEC TS 62647-2 : 1ED 2012
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 2: MITIGATION OF DELETERIOUS EFFECTS OF TIN |
|
EN 190000 : 1995
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - GENERIC SPECIFICATION: MONOLITHIC INTEGRATED CIRCUITS |
|
SAE AS 9000 : 1998
|
AEROSPACE BASIC QUALITY SYSTEM STANDARD |