Cooperating organizations
Foreword
Section 1. Principles and mandatory requirements
1.1 General matters
1.1.1 Scope
1.1.2 Related documents
1.1.3 Terminology
1.1.3.1 General terms
1.1.3.2 Integrated circuits and their functions
1.1.3.3 General descriptive terms
1.1.3.4 Terms for the characteristics of digital
circuits
1.1.3.5 Terms for the characteristics of analogue
circuits
1.1.4 Letter symbols, signs and abbreviations
1.1.4.1 Digital circuits
1.1.5 Graphical symbols
1.1.5.1 Basic symbols shapes
1.1.5.2 Connections
1.1.6 Marking of the part and package
1.1.6.1 Terminal identification
1.1.6.2 Manufacturer's type number
1.1.6.3 Factory identification code, or manufacturer's
name or trade-mark
1.1.6.4 Date code
1.1.6.5 Colour code identification for manufacturer's
type number
1.1.7 Eligibility for qualification approval:
primary stage of manufacture and sub-
contracting
1.1.7.1 Text deleted
1.1.7.2 Semiconductor integrated circuits
1.1.8 Structurally similar integrated circuits
1.1.8.1 Electrical tests in Groups A and/or C and/or
D (excluding electrical endurance tests)
1.1.8.2 Environment test in Groups B and/or C and/or D
1.1.8.3 Electrical endurance tests
1.1.8.4 Dimensional inspection
1.1.8.5 Accelerated tests
1.1.9 Delayed delivery
1.1.10 Supplementary procedure for qualification
approval
1.1.10.1 Group A tests
1.1.10.2 Group D tests
1.1.11 Certified test records
1.1.12 Standard ratings and characteristics
1.1.12.1 Supply terminal voltages
1.1.12.2 Test temperatures
1.1.12.3 Preferred temperature ranges
1.1.13 Unchecked parameters
1.1.14 Procedure to be followed in the event of
failure at Group C or D inspection
1.1.15 Ordering information
1.1.16 Release prior to completion of Group B tests
1.1.17 Supplementary procedure for reduced inspection
1.1.18 Supplementary procedure for full assessment
level components
1.1.19 Small production lots
1.1.20 Sampling procedures
1.2 Test procedures
1.2.1 Standard conditions for testing
1.2.1.1 General
1.2.1.2 Safety aspects
1.2.1.3 Drying
1.2.2 External visual inspection
1.2.3 Dimensioning and gauging procedures
1.2.4 Electrical test procedures
1.2.4.1 General
1.2.4.2 Measurement methods:
0001 etc. General
1001 etc. Functional tests
2000 etc. Digital circuits
4000 etc. Passive networks
5000 etc. Microwave circuits
1.2.5 Mechanical test procedures
1.2.5.1 Direction of acceleration/force
1.2.6 Environmental test procedures
1.2.6.1 Cold
1.2.6.2 Dry heat
1.2.6.3 High temperature storage
1.2.6.4 Damp heat, steady state
1.2.6.5 Damp heat cyclic
1.2.6.6 Shock
1.2.6.7 Bump
1.2.6.8 Vibration (sinusoidal)
1.2.6.8.1 Text deleted
1.2.6.8.2 Text deleted
1.2.6.9 Acceleration steady state
1.2.6.10 Mould growth
1.2.6.11 Corrosion
1.2.6.12 Low air pressure
1.2.6.13 Rapid change of temperature
1.2.6.14 Sealing
1.2.6.14.1 Fine leak detection
1.2.6.14.2 Gross leak detection
1.2.6.15 Soldering
1.2.6.15.1 Solderability
1.2.6.15.2 Resistance of components to solder heat
1.2.6.15.3 De-wetting
1.2.6.15.4 Ageing
1.2.6.16 Robustness of terminations
1.2.6.16.1 Tensile
1.2.6.16.2 Bending
1.2.6.16.3 Bending (row of terminations)
1.2.6.16.4 Push test
1.2.6.16.5 Torque
1.2.6.17 Flammability
1.2.6.17.1 Internal
1.2.6.17.2 External
1.2.6.18 Immersion in cleaning solvents
1.2.6.18.1 Resistance to contaminating fluids
1.2.6.19 Rapid change of temperature, two-bath method
1.2.6.20 Radiography
1.2.6.21 Damp heat steady state with bias
1.2.6.22 Thermal intermittance
1.2.6.23 Effects of moisture on solder glass seals
1.2.7 Electrical endurance test procedures
1.2.7.1 General
1.2.7.2 Test conditions
1.2.7.3 Specified conditions
1.2.8 Accelerated test procedures
1.2.8.1 Thermal overstress tests
1.2.8.1.1 General
1.2.8.1.2 Basic theory
1.2.8.1.3 Activation energy level
1.2.8.1.4 Integrated circuit groupings
1.2.8.1.5 Test procedure
1.2.8.1.6 Specified conditions
1.2.8.2 Text deleted
1.2.8.3 Text deleted
1.2.9 Screening test procedures
1.2.9.1 Seal testing
1.2.9.1(a) Order of procedure
1.2.9.1(b) Alternative order of procedure
1.2.9.1.1 Screening level A
1.2.9.1.2 Screening level B
1.2.9.1.3 Screening level C
1.2.9.1.4 Screening level D
1.2.9.1.5 Screening level E
1.2.9.2 Burn-in screen
1.2.9.3 Alternative die screening procedure
1.2.9.4 Special electrical screening tests
1.2.10 Internal visual inspection
1.2.10.1 Metallization defects
1.2.10.2 Diffusion and passivation defects
1.2.10.3 Die defects
1.2.10.4 Die orientation defects
1.2.10.5 Die mounting defects
1.2.10.6 Preform mounting and orientation defects
1.2.10.7 Insulation island (stand-off) mounting
defects
1.2.10.8 Glassivation defects
1.2.10.9 Bond defects
1.2.10.10 Internal lead wires
1.2.10.11 Package conditions
1.2.10.12 Text deleted
1.2.11 Wire bond strength
1.2.12 Die shear strength
1.3 Controlled environment
1.3.1 Air cleanliness
1.3.2 Humidity
1.3.3 Temperature
1.3.4 Biological
Section 2. Rules for the preparation of detail
specifications
2.1 Basic information
2.2 Inspection requirements for full assessment
level specifications for solid encapsulation
(plastics) devices
2.3 Certified test records
2.4 Rules for detail specifications in the full
assessment level
2.5 Rules for detail specifications in additional
assessment levels S1, S2, S3, S4 and S5
2.6 Rules for detail specifications in additional
assessment levels S11 and S12
Appendices
A. Example of a detail specification for a TTL circuit
B. List of rules for the preparation of detail
specifications
C. Text deleted
D. Test methods for thermosetting moulding or casting
material or the solid (primary), or secondary
encapsulation of silicon integrated circuits
E. Approval of materials and processing for integrated
circuits by thermal overstress tests
F. Procedure for the adoption of specifications in the
D3000 series into the BS 9000 system