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  • BS EN 123500:1992

    Current The latest, up-to-date edition.

    Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  30-11-1990

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Preface
    1. Introduction
    1.1 Scope and object
    1.2 Related documents
    2. General
    3. Test specimens
    3.1 Capability approval
    3.2 Quality conformance inspection
    4. Relevant specification
    5. Characteristics of printed boards
          Table I
          Table II
    6. Capability test programme
    7. Quality conformance inspection
    8. Test patterns
    8.1 Application of test patterns
    8.2 Composite test pattern (CTP)
    8.3 Multiple arrangements of the CTP
    Figure 2 - Composite test pattern
    Figure 3 - Examples of soldered holes
    Figure 4 - Examples related to access holes
    Figure 5 - Examples of delamination

    Abstract - (Show below) - (Hide below)

    Defines the characteristics to be assessed and the test methods to be used for capability approval testing and quality conformance inspection.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Renumbers and supersedes BS CECC23500(1990). 1992 Version incorporates amendment 7369 to BS CECC23500(1990). Supersedes 89/23560 DC and 94/216046 DC. To be read in conjunction with BS CECC23000(1989). (08/2005)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS CECC 123500-003:1994 Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections

    Standards Referencing This Book - (Show below) - (Hide below)

    CECC 00107(PT3) : 80 AMD 1 CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR CAPABILITY APPROVAL
    BS CECC23000(1989) : 1989 AMD 7145 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERAL SPECIFICATION: PRINTED BOARDS
    BS 6221-8:1982 Printed wiring boards Method for specifying single and double sided flexible printed wiring boards with through connections
    BS 6221-2:1991 Printed wiring boards Methods of test
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    BS 4584:1970 Specification for metal clad base materials for printed circuits. Methods of test
    IEC 60326-3:1991 Printed boards - Part 3: Design and use of printed boards
    BS 2011(1967) : LATEST
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