BS EN 60068-2-54:2006

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the test
5 Description of the test apparatus
   5.1 Test system
   5.2 Solder bath
6 Preconditioning
   6.1 Preparation of specimens
   6.2 Ageing
7 Materials
   7.1 Solder
   7.2 Flux
8 Procedure
   8.1 Test temperature
   8.2 Fluxing
   8.3 Flux drying
   8.4 Test
9 Presentation of results
   9.1 Form of chart-recorder trace
   9.2 Points of significance
   9.3 Reference wetting force
   9.4 Test requirements
10 Information to be given in the relevant specification
Annex A (normative) Equipment specification
Annex B (informative) Guide to the use of the wetting balance
         for solderability testing
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

Describes Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability.

IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition, published in 1985 and constitutes a technical revision. The major technical changes with regard to the previous edition concern: - the addition of lead free solder alloy (see Clause 7, Materials); - reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1); - modification to the test requirement for progress of wetting (see Clause 9).