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  • BS EN 60749-3:2017

    Current The latest, up-to-date edition.

    Semiconductor devices. Mechanical and climatic test methods External visual examination

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  24-11-2017

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Test apparatus
    5 Procedure
    6 Failure criteria
    7 Summary
    Annex A (informative) - External visual report form/checklist
            (example only - not a mandatory template)
    Bibliography
    Annex ZA (normative) - Normative references to international
             Publications with their corresponding
             European publications

    Abstract - (Show below) - (Hide below)

    Describes the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document.

    Scope - (Show below) - (Hide below)

    The purpose of this part of IEC60749 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/47
    Development Note Supersedes 00/203562 DC. (09/2002) Supersedes BS EN 60749. (09/2005) Supersedes 16/30344800 DC. (11/2017)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 61340-5-1:2016/AC:2017-05 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
    IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
    IEC 62483:2013 Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
    IEC 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
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