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  • BS EN 61188-5-4:2007

    Current The latest, up-to-date edition.

    Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides

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    Language(s): 

    Published date:  31-12-2007

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope
    2 Normative references
    3 General information
      3.1 General component description
      3.2 Marking
      3.3 Packaging
      3.4 Process considerations
    4 Small outlined J packages (SOJ)
      4.1 Component description
      4.2 Component dimensions
      4.3 Solder joint fillet design
      4.4 Land pattern dimensions
    Annex ZA (normative) - Normative references to international
             publications with their corresponding European
             publications
    Bibliography

    Abstract - (Show below) - (Hide below)

    Provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process.

    Scope - (Show below) - (Hide below)

    IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with \'J\' leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Supersedes 95/208508 DC. (01/2008)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 60286-5:2004/A1:2009 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 60286-5:2003+AMD1:2009 CSV Packaging of components for automatic handling - Part 5: Matrixtrays
    EN 60286-3:2013/AC:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
    EN 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
    IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
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