• BS EN 61188-5-5:2007

    Current The latest, up-to-date edition.

    Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides

    Available format(s): 

    Language(s): 

    Published date:  31-12-2007

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope
    2 Normative references
    3 General information
      3.1 General component description
      3.2 Marking
      3.3 Carrier packaging format
      3.4 Process considerations
    4 PQFP (square)
      4.1 Field of application
      4.2 Component descriptions
      4.3 Component dimensions
      4.4 Solder joint fillet design
      4.5 Land pattern dimensions
    5 PQFP (rectangular)
      5.1 Field of application
      5.2 Component descriptions
      5.3 Component dimensions
      5.4 Solder joint fillet design
      5.5 Land pattern dimensions
    6 PLQFP (square)
      6.1 Field of application
      6.2 Component descriptions
      6.3 Component dimensions
      6.4 Solder joint fillet design
      6.5 Land pattern dimensions
    7 PLQFP (rectangular)
      7.1 Field of application
      7.2 Component descriptions
      7.3 Component dimensions
      7.4 Solder joint fillet design
      7.5 Land pattern dimensions
    8 PTQFP (square)
      8.1 Field of application
      8.2 Component descriptions
      8.3 Component dimensions
      8.4 Solder joint fillet design
      8.5 Land pattern dimensions
    Bibliography
    Annex ZA (normative) - Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides.

    Scope - (Show below) - (Hide below)

    IEC 61188-5-5:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints.

    This publication is to be read in conjunction with IEC 61188-5-1 :2002.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Supersedes 95/208509 DC. (01/2008)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    EN 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
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