|
IPC HDBK 830 : A
|
GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
|
IEC 61189-5-503 ED 1 : 2017
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
|
IPC 9503 : 0
|
MOISTURE SENSITIVITY CLASSIFICATION FOR NON-IC COMPONENTS |
|
IPC 9704 : A
|
PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE |
|
IEC 60068-1 : 7.0
|
ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE |
|
IEC 60068-2-58 : 4.1
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
|
IEC 60068-2-20 : 5.0
|
ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
|
IPC 9252 : A
|
REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS |
|
J STD 001 : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
|
IEC 61189-5-3 : 1ED 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
|
IEC 61190-1-2 : 3.0
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
|
IPC 6018 : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARDS |
|
IEC 61249-2-7 : 1.0
|
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
|
IEC 61189-5-2 : 1ED 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
|
IPC 5702 : 0
|
GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS |
|
IPC 9703 : 0
|
IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY |
|
ISO 9455-2 : 1993(R2014)
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD |
|
IPC TM 650 : 0
|
TEST METHODS MANUAL |
|
IPC SM 840 : E
|
QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
|
IEC 61189-1 : 1.1
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY |
|
IPC HDBK 001 : E
|
HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001 |
|
IPC 9501 : 0
|
PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS) |
|
IEC 61189-6 : 1.0
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES |
|
IPC 9631 : 0
|
USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION |
|
IPC A 610 : F
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IEC 62137 : 1.0
|
ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FGBA, BGA, FLGA, LGA, SON AND QFN |
|
IPC CH 65 : B
|
GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
|
IEC 61189-5 : 1.0
|
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
|
J STD 005 : A
|
REQUIREMENTS FOR SOLDERING PASTES |
|
ISO 9455-1 : 1990(R2016)
|
SOFT SOLDERING FLUXES - TEST METHODS - PART 1: DETERMINATION OF NON-VOLATILE MATTER, GRAVIMETRIC METHOD |
|
IPC HDBK 610 : 0
|
HANDBOOK AND GUIDE TO SUPPLEMENT IPC-A-610 (INCLUDES IPC-A-610 B-C-D COMPARISONS |
|
IEC 61189-5-4 : 1ED 2015
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
|
IPC 9691 : A
|
USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING |
|
IPC 3406 : 0
|
GUIDELINES FOR ELECTRICALLY CONDUCTIVE SURFACE MOUNT ADHESIVES |
|
IEC 61190-1-1 : 1.0
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
|
IPC 9504 : 0
|
ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS) |
|
IPC 9502 : 0
|
PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS |
|
ISO 5725-2 : 1994(R 2013)
|
ACCURACY (TRUENESS AND PRECISION) OF MEASUREMENT METHODS AND RESULTS - PART 2: BASIC METHOD FOR THE DETERMINATION OF REPEATABILITY AND REPRODUCIBILITY OF A STANDARD MEASUREMENT METHOD |
|
ISO 9001:2015
|
QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS |
|
IPC 9201 : A
|
SURFACE INSULATION RESISTANCE HANDBOOK |
|
IPC AC 62 : A
|
AQUEOUS POST SOLDER CLEANING HANDBOOK |
|
IPC HDBK 840 : 0
|
SOLDER MASK HANDBOOK |
|
IPC 9641 : 0
|
HIGH TEMPERATURE PRINTED BOARD FLATNESS GUIDELINE |
|
IPC 9202 : 0
|
MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE |
|
IPC 9203 : 0
|
USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE |
|
J STD 020 : D-1
|
MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
|
IPC 9261 : A
|
IN-PROCESS DPMO AND ESTIMATED YIELD FOR PCAS |
|
IPC 5701 : 0
|
USERS GUIDE FOR CLEANLINESS OF UNPOPULATED PRINTED BOARDS |
|
IPC 7912 : A
|
END-ITEM DPMO FOR PRINTED CIRCUIT BOARD ASSEMBLIES |
|
IEC 61190-1-3 : 2.1
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
|
IPC 6012 : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |