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  • BS EN 61190-1-2:2014

    Current The latest, up-to-date edition.

    Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  30-06-2014

    Publisher:  British Standards Institution

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    IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material\'s performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
    a) modification of the solder powder size in Table 2;
    b) addition of the information of \'Reflow condition and profile\' in Annex B;
    c) addition of a new Annex C.

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    Committee EPL/501
    Development Note Supersedes 98/231474 DC. (08/2002) Supersedes 05/30133283 DC. (08/2007) Supersedes 12/30258438 DC. (06/2014)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
    ISO 9454-2:1998 Soft soldering fluxes Classification and requirements Part 2: Performance requirements
    EN ISO 9454-2:2000 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
    IPC HDBK 005 : 0 GUIDE TO SOLDER PASTE ASSESSMENT
    IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
    EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
    IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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