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  • BS EN 61192-3:2003

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  08-05-2019

    Language(s):  English

    Published date:  07-04-2003

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General requirements
       4.1 Classification
       4.2 Conflict
       4.3 Inspection techniques
       4.4 Interpretation of requirements
    5 Component preparation processes
       5.1 Lead forming
       5.2 Lead protrusion and clinching
       5.3 Lead cutting/cropping
       5.4 Pre-tinning
    6 Masking attributes
       6.1 Misalignment
       6.2 Improper adhesion
       6.3 Thermal capability
    7 Insertion of through-hole components
       7.1 General requirements
       7.2 Orientation and mounting criteria
       7.3 Missing components
       7.4 Wrong components
       7.5 Damaged components
    8 Soldering process attributes
       8.1 General requirements
       8.2 Misalignment
       8.3 Damaged components
       8.4 Solder joint characteristics
    9 Cleaning attributes
       9.1 Flux residues
       9.2 Other residues
    10 Rework/replacement attributes
    Annex ZA (normative) Normative references to international
             publications with their corresponding European publications

    Abstract - (Show below) - (Hide below)

    Provides general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

    Scope - (Show below) - (Hide below)

    Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Supersedes 98/232815 DC (04/2003)
    Document Type Standard
    Publisher British Standards Institution
    Status Withdrawn
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
    EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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