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  • BS EN 62137:2004

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

    Available format(s):  Hardcopy, PDF

    Superseded date:  30-06-2015

    Language(s):  English

    Published date:  13-05-2005

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Abbreviations
    5 Solder joint quality test methods
       5.1 Reflow solderability test for solder joint
       5.2 Reserved for future use
    6 Mechanical test methods
       6.1 Bending test for solder joint
       6.2 Drop test for solder joint
    7 Environment test methods
       7.1 Temperature cycling test for solder joint
       7.2 Reserved for future use
    Annex A (informative) Informative test methods for test
                          board - Guidance
    Annex B (informative) Standard mounting process for area
                          array type packages and peripheral
                          terminal type packages (QFN and SON)
    Annex ZA (normative) Normative references to international
                          publications with their corresponding
                          European publications
    Bibliography
    Figures
    Tables

    Abstract - (Show below) - (Hide below)

    Defines the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Supersedes 01/202664 DC (11/2004)
    Document Type Standard
    Publisher British Standards Institution
    Status Superseded
    Superseded By
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    EN 60191-6-2:2002 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 60749-1:2002 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
    IEC 60191-6-2:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    IEC 60068-2-44:1995 Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
    EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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