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MIL STD 883 : K
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TEST METHOD STANDARD - MICROCIRCUITS |
|
EIA 599 : 1998
|
NATIONAL ELECTRONIC PROCESS CERTIFICATION STANDARD |
|
J STD 026 : 0
|
SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS |
|
ISO/IEC 11179-3 : 2013
|
INFORMATION TECHNOLOGY - METADATA REGISTRIES (MDR) - PART 3: REGISTRY METAMODEL AND BASIC ATTRIBUTES |
|
EN 62258-2 : 2011
|
SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
|
IEC 61340-5-1 : 2.0
|
ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS |
|
MIL PRF 19500 : P
|
SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
|
EIA 554 : 1996
|
METHOD SELECTION FOR ASSESSMENT OF NONCONFORMING LEVELS IN PARTS PER MILLION (PPM) |
|
MIL PRF 38534 : J
|
HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
|
IEC TR 61340-5-2 : 1.0
|
ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
|
IEC 60749-27 : 2.1
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 27: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - MACHINE MODEL (MM) |
|
IEC 62258-5 : 1.0
|
SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION |
|
FED STD 209 : E
|
AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES |
|
J STD 033 : C-1
|
HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
|
J STD 012 : 0
|
IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
|
IEC TR 62258-8 : 1.0
|
SEMICONDUCTOR DIE PRODUCTS - PART 8: EXPRESS MODEL SCHEMA FOR DATA EXCHANGE |
|
IEC 61360-1 : 4.0
|
STANDARD DATA ELEMENT TYPES WITH ASSOCIATED CLASSIFICATION SCHEME - PART 1: DEFINITIONS - PRINCIPLES AND METHODS |
|
CLC/TR 62258-8 : 2008
|
SEMICONDUCTOR DIE PRODUCTS - PART 8: EXPRESS MODEL SCHEMA FOR DATA EXCHANGE |
|
CLC/TR 62258-3 : 2007
|
SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
|
IEEE 1076 : 2008
|
STANDARD VHDL LANGUAGE REFERENCE MANUAL |
|
EN 62258-6 : 2006
|
SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION |
|
IEEE 1029.1 : 1998
|
IEEE STANDARD FOR VHDL WAVEFORM AND VECTOR EXCHANGE (WAVES) TO SUPPORT DESIGN AND TEST VERIFICATION |
|
IEC 60749-26 : 3.0
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 26: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - HUMAN BODY MODEL (HBM) |
|
EN 62258-5 : 2006
|
SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION |
|
IEC TR 62258-7 : 1.0
|
SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE |
|
ISO 8879 : 1986(R2008)
|
INFORMATION PROCESSING - TEXT AND OFFICE SYSTEMS - STANDARD GENERALIZED MARKUP LANGUAGE (SGML) |
|
IEC 62258-2 : 2.0
|
SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
|
IEC TR 62258-3 : 2.0
|
SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
|
ISO 14644-1 : 2015
|
CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 1: CLASSIFICATION OF AIR CLEANLINESS BY PARTICLE CONCENTRATION |
|
IEC 62258-6 : 1.0
|
SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION |
|
ISO 9000 : 2015
|
QUALITY MANAGEMENT SYSTEMS - FUNDAMENTALS AND VOCABULARY |
|
J STD 028 : 0
|
PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS |
|
EIA 599 : 1998
|
NATIONAL ELECTRONIC PROCESS CERTIFICATION STANDARD |
|
IEC 60191-4 : 3.0
|
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 4: CODING SYSTEM AND CLASSIFICATION INTO FORMS OF PACKAGE OUTLINES FOR SEMICONDUCTOR DEVICE PACKAGES |
|
CLC/TR 62258-4 : 2013
|
SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS (IEC/TR 62258-4:2012) |
|
IEC TR 62258-4 : 2.0
|
SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS |
|
EIA 557 : 2006
|
STATISTICAL PROCESS CONTROL SYSTEMS |
|
J STD 020 : D-1
|
MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
|
EN ISO 14644-1 : 2015
|
CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 1: CLASSIFICATION OF AIR CLEANLINESS BY PARTICLE CONCENTRATION (ISO 14644-1:2015) |
|
CLC/TR 62258-7 : 2007
|
SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE |