HD 323.2.20 : 200S3
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BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
EN 61249-5-1:1996
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Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
IEC 61249-2-11:2003
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Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
IEC 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC 61249-2-7:2002
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Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
IEC 61188-1-1:1997
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Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies |
EN 62326-4-1:1997
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Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C |
IEC 62326-1:2002
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Printed boards - Part 1: Generic specification |
IEC 61249-5-1:1995
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Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
IEC 60068-2-38:2009
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Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
HD 323.2.3 : 200S2
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BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE |
IEC 61249-4-11:2005
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Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability |
IEC 60068-2-3:1969
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Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
IEC 61189-3:2007
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
IEC 61188-5-1:2002
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Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
IEC 61249-2-9:2003
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Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
IEC 62326-4-1:1996
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Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C |
EN 62326-1:2002
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Printed boards - Part 1: Generic specification |
IEC 61249-8-7:1996
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Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks |
HD 323.2.38 : 200S1
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BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TESTS Z/AD: COMPOSITE TEMPERATURE/HUMIDITY CYCLIC TEST |