BS IEC 61163-2:1998

INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Procedure
    4.1 General
    4.2 Programme definition
    4.3 Establish contact between the two parties
          involved
    4.5 Select stress types, stress levels and stress
          sequence to be used in order to precipitate
          failures
    4.6 Determine the duration of the reliability stress
          screening process
    4.7 Mathematically analyze initial test results
    4.8 Perform failure analysis
    4.9 Perform stress sequence on the components
    4.10 Determine approval or rejection criteria
    4.11 Develop closed-loop corrective action process
    4.12 Provide feedback to the component manufacturers
    4.13 Discontinue the reliability stress screening
          process
Figure 1 Component reliability screening process (general
          flow chart)
Figure 2 Corrective action process
Annex A (informative) Examples of tools for identifying
          failure mechanisms in electronic components
Annex B (informative) Data analysis
Annex C (informative) Examples of applications of reliability
          stress screening processes

Gives guidance on reliability stress screening techniques and methods for electronic components. Is not exhaustive due to the rapid development of the electronics industry.