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  • PD IEC/TR 62258-7:2007

    Current The latest, up-to-date edition.

    Semiconductor die products XML schema for data exchange

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  30-11-2007

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope
    2 Normative references
    3 Definitions
    4 General
    5 Data exchange
    Annex A (normative) - XML schema
    Annex B (informative) - XML example
    Bibliography

    Abstract - (Show below) - (Hide below)

    Assists the production, supply and use of semiconductor die products, including: - wafers; - singulated bare die; - die and wafers with attached connection structures; - minimally or partially encapsulated die and wafers.

    Scope - (Show below) - (Hide below)

    This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/47
    Development Note Supersedes 06/30146849 DC. (12/2007)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
    IEC 62258-5:2006 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
    IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
    IEC 62258-6:2006 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
    IEC TR 62258-4:2012 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
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