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  • PD IEC/TS 62239-1:2015

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan

    Available format(s):  Hardcopy, PDF

    Superseded date:  13-12-2018

    Language(s):  English

    Published date:  30-04-2015

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms, definitions and abbreviations
    4 Technical requirements
    5 Plan administration requirements
    Annex A (informative) - Requirement matrix for IEC TS
            62239-1
    Annex B (informative) - Typical qualification requirements
            and typical component minimum qualification
            requirements
    Annex C (informative) - Semiconductor reliability and
            wear out
    Annex D (informative) - Guidelines for environmental
            protection techniques and for comparison of
            components specifications
    Bibliography

    Abstract - (Show below) - (Hide below)

    Specifies the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements.

    Scope - (Show below) - (Hide below)

    This part of IEC62239 , which is a technical specification, defines the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause4 are accomplished. In general, the plan owner of a complete Electronic Components Management Plan is the avionics original equipment manufacturer (OEM). This document provides an aid in the aerospace certification process. Although developed for the avionics industry, this process may be applied by other industrial sectors.

    General Product Information - (Show below) - (Hide below)

    Committee GEL/107
    Development Note Supersedes DD IEC/TS 62239. (08/2012)
    Document Type Standard
    Publisher British Standards Institution
    Status Superseded
    Superseded By
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    SAE AS 5553B : 2016 COUNTERFEIT ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    GEIA STD 0005-3 : 2013 PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES
    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    IECQ 001003:1998 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - GUIDANCE DOCUMENTS
    IEC 61967-1:2002 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
    IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
    MIL-PRF-19500 Revision P:2010 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
    ISO/TS 16949:2009 Quality management systems Particular requirements for the application of ISO 9001:2008 for automotive production and relevant service part organizations
    IEC TS 62668-2:2016 Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources
    IEC TR 61340-5-2:2007 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
    IEC TS 62668-1:2016 Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components
    RTCA DO 254 : 2000 DESIGN ASSURANCE GUIDANCE FOR AIRBORNE ELECTRONIC HARDWARE
    SAE J 1752/3 : 2011 MEASUREMENT OF RADIATED EMISSIONS FROM INTEGRATED CIRCUITS - TEM/WIDEBAND TEM (GTEM) CELL METHOD; TEM CELL (150 KHZ TO 1 GHZ), WIDEBAND TEM CELL (150 KHZ TO 8 GHZ)
    IEC TR 62240-1:2013 Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
    GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    ESDA/JEDEC JS-001 : 2017 ELECTROSTATIC DISCHARGE SENSITIVITY TESTING - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL
    IEC Q 01 : 5.0 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - BASIC RULES
    IEC QC 001004 : 2.0
    GEIA STD 0005-2 : 2012 MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    SAE AS 9000 APPENDIX 1 : 1998 AS 9000 AUDIT SUMMARY AND SUPPLIER PROFILE INSTRUCTIONS
    IEC TS 62647-3:2014 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
    IEC 62396-4:2013 Process management for avionics - Atmospheric radiation effects - Part 4: Design of high voltage aircraft electronics managing potential single event effects
    GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
    ISO 9004:2009 Managing for the sustained success of an organization A quality management approach
    MIL-HDBK-263 Revision B:1994 ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL & ELECTRONIC PARTS, ASSEMBLIES & EQUIPMENT
    IEC TS 62564-1:2016 Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
    IEC Q 03-4 : 3.0 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PRODECURE - PART 4: IECQ AVIONICS SCHEME - AVIONICS PARTS AND ASSEMBLY MANAGEMENT
    GEIA STD 0016 : 2012 PREPARING A DMSMS MANAGEMENT PLAN
    IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    IEC 62396-5:2014 Process management for avionics - Atmospheric radiation effects - Part 5: Assessment of thermal neutron fluxes and single event effects in avionics systems
    IEC 62396-3:2013 Process management for avionics - Atmospheric radiation effects - Part 3: System design optimization to accommodate the single event effects (SEE) of atmospheric radiation
    ISO 9001:2015 Quality management systems — Requirements
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    ISO 9000:2015 Quality management systems — Fundamentals and vocabulary
    MIL-PRF-38535 Revision K:2013 Integrated Circuits (Microcircuits) Manufacturing, General Specification for
    SAE AS 6496 : 2014 FRAUDULENT/COUNTERFEIT ELECTRONIC PARTS: AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION - AUTHORIZED/FRANCHISED DISTRIBUTION
    AIAA R 100 : A 2001 RECOMMENDED PRACTICE FOR PARTS MANAGEMENT
    MIL-STD-3018 Base Document:2007 Parts Management (S/S by MIL-STD-11991)
    IEC 62396-1:2016 Process management for avionics - Atmospheric radiation effects - Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment
    GEIA STD 0002-1 : 2005 AEROSPACE QUALIFIED ELECTRONIC COMPONENT (AQEC) REQUIREMENTS, VOLUME 1 - INTEGRATED CIRCUITS AND SEMICONDUCTORS
    IEC 60695-11-5 : 2.0 FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
    IEC 60695-11-5:2016 Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance
    IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
    EN 190000:1995 Generic Specification: Monolithic integrated circuits
    EIA 4899 : 2001 STANDARD FOR PREPARING AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
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