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  • PD IEC/TS 62647-2:2012

    Current The latest, up-to-date edition.

    Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  31-01-2013

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms, definitions and abbreviations
    4 Technical requirement
    Annex A (informative) - Guidance on control levels,
            risk assessment, and mitigation evaluation
    Annex B (informative) - Technical guide on detection
            methods, mitigation methods, and methods for
            limiting impact of tin
    Annex C (informative) - Tin whisker inspection
    Annex D (informative) - Analysis and risk assessment
            guidance
    Annex E (informative) - Whiskers growing from solder
            joint fillets and bulk solder
    Bibliography

    Abstract - (Show below) - (Hide below)

    Gives processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems.

    Scope - (Show below) - (Hide below)

    This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems.

    This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes.

    This document may be used by other high-performance and high-reliability industries, at their discretion.

    General Product Information - (Show below) - (Hide below)

    Committee GEL/107
    Document Type Standard
    Publisher British Standards Institution
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC PAS 62647-3:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC CC 830 : B QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
    MIL-I-46058 Revision C:1972 Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
    IEC TS 62239-1:2015 Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-23:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    MIL-STD-1580 Revision B:2003 DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    GEIA STD 0006 : 2008 REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
    IEC PAS 62647-21:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
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