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  • PD IEC/TS 62878-2-4:2015

    Current The latest, up-to-date edition.

    Device embedded substrate Guidelines. Test element groups (TEG)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  30-04-2015

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms, definitions and abbreviations
    4 Test conditions and sample preparation
    5 TEG
    Bibliography

    Abstract - (Show below) - (Hide below)

    Defines the test element group devices useful when measuring basic properties of device embedded substrates.

    Scope - (Show below) - (Hide below)

    This part of IEC 62878 describes the test element group devices useful when measuring basic properties of device embedded substrates.

    This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

    The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Document Type Standard
    Publisher British Standards Institution
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
    IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
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