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  • CECC 00803 : 1995

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    GUIDANCE DOCUMENT: VISUAL INSPECTION OF SOLDERED SURFACE MOUNTED ASSEMBLIES

    Available format(s): 

    Superseded date:  11-12-1998

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Cenelec Electronic Components Committee

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    Table of Contents - (Show below) - (Hide below)

    1 Introduction
    2 Scope
    3 Related Documents
    4 Terminology
    4.1 Definitions
    4.2 Abbreviations, letter symbols and signs
    5 Pre-Assembly In-Process Visual Inspection
    5.1 Method of Inspection
    5.2 Unpopulated printed boards and surface mounting
         components
    5.3 Solder paste deposition
    5.4 Non-Conductive Adhesive Deposition
    5.5 Component Placement
    5.6 Populated Board prior to Reflow Soldering/Adhesive Curing
    6 Post Soldering Visual Inspection of Surface Mounted
         Assemblies
    6.1 Method of Inspection
    6.2 General requirements for visual inspection of all SM
         soldered components and assemblies
    6.3 General requirements for visual inspection of SM soldered
         assemblies
    6.4 Visual inspection of SM component solder joints

    Abstract - (Show below) - (Hide below)

    Refers to visual inspection criteria for electronic assemblies containing surface mounted components.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Cenelec Electronic Components Committee
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 160100 : 1997 CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OFASSESSED QUALITY (SECTIONAL SPECIFICATION)
    BS EN 160100:1998 Harmonized system of quality assessment for electronic components. Sectional specification: capability approval of manufacturers of printed board assemblies of assessed quality
    BS EN 160200-2:1998 Harmonized system of quality assessment for electronic components. Sectional specification. Microwave modular electronic units of assessed quality Index of test methods
    I.S. EN 160200-2:1998 MICROWAVE MODULAR ELECTRONIC UNITS OF ASSESSED QUALITY - PART 2: INDEX OF TEST METHODS (SECTIONAL SPECIFICATION)
    I.S. EN 160100:1998 CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OFASSESSED QUALITY (SECTIONAL SPECIFICATION)
    EN 160200-2 : 1997 MICROWAVE MODULAR ELECTRONIC UNITS OF ASSESSED QUALITY - PART 2: INDEX OF TEST METHODS (SECTIONAL SPECIFICATION)
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