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  • CEI CECC 200025 : 2000

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD ASSEMBLY FACILITIES

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  01-07-2020

    Language(s):  English

    Published date:  01-01-2000

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    Introduction
    1 General requirements
    2 Quality requirements of the process sequence
    3 Specialist Assembly Facility documentation requirements
    4 Audits
    5 Corrective actions and failure analysis
    6 Interface between Assembly Facility and Customer
    7 Training
    8 Notification of modifications to capability
    Annexes
    Annex A - Definitions
    Annex B - Form and content of process specifications
    Annex C - Form and content of Process Manuals
    Annex D - Format of first page of Process Approval report
    Annex E - Example abstract of description of Process Approval
    Annex F - Audit check list (technical)
    Annex G - Abbreviations

    Abstract - (Show below) - (Hide below)

    Defines the terms, definitions, symbols, quality system, assessment and verification methods, and other requirements relevant to the operation of a printed board Assembly Facility in compliance with the general requirements of the CECC System for electronic components of assessed quality.

    General Product Information - (Show below) - (Hide below)

    Committee CT 309
    Development Note Classificazione CEI 91-1 (01/2003)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Withdrawn

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    EN ISO 9002:1994/AC:1997 QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION
    CECC 00114-5 : 94 AMD 2 PROCESS APPROVAL OF SPECIALIST CONTRACTORS WITHIN THE ELECTRONIC COMPONENTS INDUSTRY
    EN 100114-1 : 1996 RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    CECC 00200 : 2002 REGISTER OF FIRMS, PRODUCTS AND SERVICES APPROVED UNDER CECC CERTIFICATION SYSTEM FOR ELECTRONIC COMPONENTS
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    CECC 200 012 : 1995 PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD DESIGNED FACILITIES
    CECC 00401 : 91 AMD 1 GLOSSARY OF ABBREVIATIONS, TERMS AND DEFINITIONS OF THE CECC SYSTEM
    EN ISO 9000:2015 Quality management systems - Fundamentals and vocabulary (ISO 9000:2015)
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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