CEI EN 60191-6-1 : 2003

Current

Current The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GULL-WING LEAD TERMINALS

Available format(s): Hardcopy, PDF

Language(s): English

Published date: 01-01-2003

Publisher: Comitato Elettrotecnico Italiano

Table of Contents - (Show below) - (Hide below)

FOREWORD
1 Scope
2 Normative references
3 Definitions
4 References and drawings
5 Outline dimensions
6 Package height and stand-off height
7 Terminal thickness and width
8 Terminal shape
9 Tolerance of terminal center position and coplanarity
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Abstract - (Show below) - (Hide below)

Describes the requirements for the design rule of terminal shape plastic packages with gull-wing leads; e.g., QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4.

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Committee	CT 309
Development Note	Classificazione CEI 47-13 (02/2003)
Document Type	Standard
ISBN
Pages
Published
Publisher	Comitato Elettrotecnico Italiano
Status	Current

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
IEC 60191-6-1:2001	Identical
EN 60191-6-1:2001	Identical

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60191-6:2009	Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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