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  • CEI EN 60749-15 : 2012

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES

    Available format(s):  Hardcopy, PDF

    Superseded date:  16-10-2021

    Language(s):  English

    Published date:  01-01-2012

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 General
    3 Test apparatus
    4 Materials
    5 Procedure
    6 Summary
    Bibliography

    Abstract - (Show below) - (Hide below)

    Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.

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    Committee CT 309
    Development Note Classificazione CEI 47-45. (01/2006) Supersedes CEI EN 60749. (05/2008)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Superseded
    Superseded By
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
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